Powered by Made-in-China.com
Small Semiconductor Die Bonding System Wafer Die Attach Eutectic Bonder
US$100,000.00-1,000,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
ProvidedCondition
NewSpeed
High SpeedPrecision
High PrecisionCertification
ISOWarranty
12 MonthsAutomatic Grade
AutomaticProduct Name
Semiconductor EquipmentFeature 1
Guaranteed QualityFeature 2
Customized According to NeedsAfter-Sale Service
ProvidedTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaKey features
High Precision Operation: Equipped with high precision capabilities for accurate semiconductor die bonding.
High Speed Performance: Designed for high speed operation to maximize production efficiency.
ISO Certified Quality: Meets international ISO certification standards for quality assurance.
Flexible Customization: Offers flexible customization options to meet specific customer needs.
OEM and ODM Services: Provides both OEM and ODM services for tailored equipment solutions.
Comprehensive After-Sales: Includes 24-hour online professional technical support and warranty service.
12 Months Warranty: Provides a one-year warranty period for all equipment.
Global Market Reach: Equipment exported to over 30 countries with a proven track record.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.07h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.
Q:What are the available payment terms?
A:
We accept LC, T/T, PayPal, and Western Union.
Q:What is the lead time for delivery?
A:
Peak season lead time is 3-6 months, and off-season lead time is 1-3 months.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
You may also like
Automatic Semiconductor Soft Solder Bonding Die Attach Solution SD800 Die Bonder
US$7,000.00-70,000.00
1 Piece(MOQ)
Semiconductor Packaging Die Bonder Bonding Machine Eutectic Crystal Planting Machine
US$50,000.00-100,000.00
1 Piece(MOQ)
Small Semiconductor Die Bonding System, Wafer Die Attach Eutectic Bonder dB100
US$90,500.00-119,000.00
1 Piece(MOQ)
China Manufacturer Semiconductor Flip Chip Package Die Bonder Die Attach Bonding Machine
US$100,000.00-1,000,000.00
1 Piece(MOQ)
Desktop Laboratory Gantry High-Precision Small Multifunctional Automatic Die Attach Die Mounter Automatic Eutectic Patch Chip Bonder
US$116,000.00-150,000.00
1 Piece(MOQ)
Asm Ad830 Plus Die Bonding Machine Semiconductor Equipment Asmpt Die Bonder
US$100,000.00-1,000,000.00
1 Set(MOQ)
China Small Eutectic Die Bonder with Heated Collet Bond Head
US$90,500.00-119,000.00
1 Piece(MOQ)
Tec Optical Device Flip Chip Die Bonder Die Bonding Eutectic Die Attach
US$50,000.00-100,000.00
1 Piece(MOQ)
Advanced High-Precision Wafer Die Bonder with Intelligent Control System
US$100,000.00-1,000,000.00
1 Piece(MOQ)
Semiconductor High Precision Asmpt Siplace Ca2 Plus Die Bonding and Flip Chip Placement Bonder
US$100,000.00-1,000,000.00
1 Set(MOQ)
Asm Semiconductor Equipment Supplier Bonding Machine Manufacturers CB832 Automatic Die Bonder
US$100,000.00-1,000,000.00
1 Set(MOQ)
Gkg Gd210 Precision Die Bonder - 10-Inch Auto Wafer Ring Changer & Film Expander for 600×510mm Large Substrate Semiconductor Packaging
US$22,500.00-48,000.00
1 Piece(MOQ)
High Precison 1um R&D Small Flip Chip Die Bonder dB100s
US$90,500.00-119,000.00
1 Piece(MOQ)
Asm Semiconductor Equipment Manufacturers Cm Linda Automatic Bonding Machine Supplier Die Bonder
US$100,000.00-1,000,000.00
1 Set(MOQ)
Ad832I Fully Automatic Asm Die Bonding Machine, Semiconductor Die Bonder for IC Packaging Production
US$100,000.00-120,000.00
1 Piece(MOQ)
High Accuracy Die Bonder with Epoxy and Eutectic
US$90,500.00-119,000.00
1 Piece(MOQ)
High-Precision Eutectic Die Bonder for Superior Wafer Production
US$300,000.00-500,000.00
1 Piece(MOQ)
Used Fully Automatic Asmpt Die Bonding Machine System Ad832I Semiconductor Equipment Die Bonder
US$19,999.00-23,999.00
1 Piece(MOQ)
Gkg Gd80+C Automatic Precision Die Bonder Lightweight Dual Swing Arm for LED & Semiconductor
US$12,500.00-38,000.00
1 Piece(MOQ)