Powered by Made-in-China.com
Asm Semiconductor Equipment Supplier Bonding Machine Manufacturers CB832 Automatic Die Bonder
US$100,000.00-1,000,000.00
1 Set
Product profile
Customization
AvailableAfter-sales Service
Video Technical SupportCondition
NewModel NO.
CB832Speed
High SpeedPrecision
High PrecisionCertification
CCC, PSE, FDA, RoHS, ISO, CEWarranty
6 MonthsAutomatic Grade
AutomaticType
Die BonderDelivery
1-7 DaysMOQ
1 PCQuality
100% TestedAdaptation
Asm Die BonderInventory
AvailabilityTransport Package
Plastic Bag&Carton BoxSpecification
1700 KGTrademark
asmOrigin
GermanyHS Code
8479896200Production Capacity
5PCS/YearCompany profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 5 years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤4.61h
About Our Factory & Business Background
AddressChuangzhi Park, Congxinqiao 107, No. 18 Shangliao Industrial Road, Shangnan Shangliao Community, Xinqiao Street, Shenzhen, Guangdong, China
Plant Area600 square meters
Number of Employees11
Registered Capital5,000,000 RMB
Terms of PaymentT/T
International Commercial Terms(Incoterms)EXW, FOB, CIF
Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Minimum Order Quantity1 PCS
Supply Chain Partners5
Our Production Capability & Technical Expertise
Main ProductsOne-Stop SMT Equipment and Parts, SMT Screen Printer, Chip Mounter, One-Stop Semiconductor Equipment and Part, Die Bonders, Wire Bonders, Test Handler, Wafer Dicing Saw, Fiber Optic Cable, Optical Transceiver
Production Lines1
Production MachinesSMT Component Tester, Automatic Welding Facility, Soldering Iron, Oscilloscope
QA/QC inspectors2 people
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsHave instructions and uniformly followed
R&D Engineers2 people
Traceability of Raw MaterialsYes
Own BrandYes
Our Industry Experience & Global Business Record
Year of Establishment2021-01-28
Main MarketsEurope, Domestic, South Asia
Repeat Buyers Choice50%~80%
Number of Foreign Trading Staff2
Overseas Agent/BranchNo
New Products Launched in Last yearYes
Our Certifications, Standards & Industry Recognition
Cooperated with Fortune 500No
Send Inquiry
*To:
Guangdong Xinling Industrial Co., Ltd
Guangdong Xinling Industrial Co., Ltd*Content:
Supplier replies will be sent to your registered email
You may also like
Semiconductor Packaging Die Bonder Bonding Machine Eutectic Crystal Planting Machine
US$50,000.00-100,000.00
1 Piece(MOQ)
Ad832I Fully Automatic Asm Die Bonding Machine, Semiconductor Die Bonder for IC Packaging Production
US$100,000.00-120,000.00
1 Piece(MOQ)
China Manufacturer Semiconductor Flip Chip Package Die Bonder Die Attach Bonding Machine
US$100,000.00-1,000,000.00
1 Piece(MOQ)
Asm Ihawkv Automatic Wire Bonding Machine Supplier Eagle-Aero-Gocu Gold Wire Ball Bonder
US$100,000.00-1,000,000.00
1 Set(MOQ)
Asm Automatic Gold Wire Ball Bonding Machine Suppliers Eagle-Aero-Gocu Wire Bonder
US$100,000.00-1,000,000.00
1 Set(MOQ)
High-Precision Semiconductor Wafer Bonder for Advanced Die Bonding
US$100,000.00-1,000,000.00
1 Piece(MOQ)
Desktop High Precision Semi-Automatic Die Bonder Crystal Bondering Machine Db100
US$90,500.00-119,000.00
1 Piece(MOQ)
Semiconductor Packaging Testing Equipment Supplier Manufacturers YAMAHA Ysh20 Flip Chip Mounter Bonder
US$100,000.00-1,000,000.00
1 Set(MOQ)
Gkg Gd80+C Automatic Precision Die Bonder Lightweight Dual Swing Arm for LED & Semiconductor
US$12,500.00-38,000.00
1 Piece(MOQ)
Automatic High Speed Epoxy Die Bonder Machine Manufacturer
US$7,000.00-70,000.00
1 Piece(MOQ)
High Precision Asm Die Bonder Ad819 Dispensing Equipment for Semiconductor Packaging Solutions
US$10,000.00-1,000,000.00
1 Set(MOQ)
Small Semiconductor Die Bonding System Wafer Die Attach Eutectic Bonder
US$100,000.00-1,000,000.00
1 Piece(MOQ)
Small Semiconductor Die Bonding System, Wafer Die Attach Eutectic Bonder dB100
US$90,500.00-119,000.00
1 Piece(MOQ)
Gkg Gd210 Precision Die Bonder - 10-Inch Auto Wafer Ring Changer & Film Expander for 600×510mm Large Substrate Semiconductor Packaging
US$22,500.00-48,000.00
1 Piece(MOQ)
dB100s Submicron Pick and Place Machine Die Bonder with Flip Chip
US$90,500.00-119,000.00
1 Piece(MOQ)
Gkg Gd91m2 Precision Die Bonder - Dual Arm 180° Rotation Die Bonding Equipment for Backlight & Direct Display
US$12,500.00-38,000.00
1 Piece(MOQ)
Semiconductor Equipment Automatic Besi Flip Chip Wedge Wire Bonding Machine Datacon 2200 Evo Series Die Bonder
US$147,000.00-272,000.00
1 Piece(MOQ)
Small Die Bonder Die Pick and Place Machine for Wafer
US$90,500.00-119,000.00
1 Piece(MOQ)
Micro LED Mini LED Semiconductors Mems Devices RF Microwave Hybrid Circuits Desktop Die Bonder Die Attach Mounter Chip Bonding Placement
US$116,000.00-150,000.00
1 Piece(MOQ)