Powered by Made-in-China.com
Automatic High Speed Epoxy Die Bonder Machine Manufacturer
US$7,000.00-70,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
Free TrainingCondition
NewModel NO.
DBM-1029Speed
Super High SpeedPrecision
High PrecisionCertification
RoHS, ISO, CEWarranty
24 MonthsAutomatic Grade
AutomaticType
Ultra High-speed Chip MounterProduct Name
Die Bonder MachineItem Number
Shark-1Leading Production Capacity
20000uphWelding Head Force
30- 300 GWafer Size
12~8 InchesTransport Package
Wooden Box by Sea ShippingSpecification
standard packageTrademark
HimalayaOrigin
ChinaProduction Capacity
5000Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.14h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
You may also like
Automatic High Precision Die Bonder Die Bonding Machine for COB Box to Tec Mems HDMI
US$140,000.00-220,000.00
1 Piece(MOQ)
Used Asm Wire Bonder High Precision Automatic Semiconductor Die & Wire Bonding Machine for SMT Packaging Line
US$25,000.00-39,999.00
1 Piece(MOQ)
Used Asm Wire Bonder, High Precision Automatic Die & Wire Bonding Machine for Semiconductor Packaging Line
US$25,000.00-39,999.00
1 Piece(MOQ)
Semiconductor IC / to Package Machine Automatic Die Attach Die Bonder Bonding Machine
US$50,000.00-99,999.00
1 Piece(MOQ)
Fully Automatic Die Bonding Machine System Manufacturer
US$50,000.00-70,000.00
1 Piece(MOQ)
Tec Mems to Chip Automatic Die Bonder Bonding Eutectic Crystal Planting Machine
US$25,000.00-200,000.00
1 Piece(MOQ)
High Precision Die Bonder Machine for Semiconductor Wafer Placement
US$100,000.00-1,000,000.00
1 Piece(MOQ)
Factory Direct High Speed Automatic LED Pick and Place Equipment Chip Mounter Machine Manufacturer in China
US$50,000.00-60,000.00
1 set(MOQ)
Gkg High-Speed Flexible Sheet/Tape Die Bonding Machine for Semiconductor Assembly
US$32,500.00-58,000.00
1 Piece(MOQ)
Semiconductor High End Wafer Bonder High-Precision Die Bonding Machine Made in China
US$100,000.00-1,000,000.00
1 Piece(MOQ)
High Precision Semiconductor Equipment Die Bonding Machine Fully Automatic
US$50,000.00-100,000.00
1 Piece(MOQ)
High Speed SMT Manufacturer Samsung 482 Plus The Best SMT Pick and Place Machine Chipbest Mounting Machine
US$73,000.00-79,000.00
1 Set(MOQ)
SMT Machine Samsung Equipment PCB Manufacturer High Speed Mounter Pick and Place Machine
US$67,800.00-68,500.00
1 Set(MOQ)
KOH Young 8030 Nova 3D Spi Inspection Quantum Machine Manufacture Die Bonder
US$70,000.00
1 Piece(MOQ)
High Speed Full Automatic Pick and Place Machine, Chip Mounting Machine for SMT Assembly
US$5,000.00-105,000.00
1 Set(MOQ)
China Semiconductor Manufacturing High Frequency Cof Wire Bonder Cm Linda Asmpt Automatic Wafer Die Acf Bonding Machine
US$35,000.00-65,000.00
1 Set(MOQ)
