Top Quality Semiconductor Equipment Cpm1180 Fully Automatic and Semi-Automatic and Manual Towa Compression Molding Machine

Its core advantage lies in its capability to process the industry's leading ultra-large substrates. Specifically: Ultra-Large Substrate Support: It can handle substrates measuring up to 660mm x 620mm, directly resulting in a significant leap in production efficiency. Large-Format Wafer Support: It simultaneously supports 18-inch (450mm) wafer-level packaging, thereby enhancing the equipment's versatility. Proprietary "Cavity Down" Structure: This constitutes its core technology. During the packa

Its primary application areas include the following: Panel-Level Packaging (PLP): This constitutes its core positioning, leveraging its ultra-large processing area capabilities to perform packaging on a large-format panel, thereby achieving cost reduction objectives. Wafer-Level Packaging (WLP): It also possesses the capability to process 18-inch wafers, supporting processes such as Fan-Out Wafer-Level Packaging (FOWLP). Heterogeneous Integration: It enables the integration of chips with differe