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Semiconductor Equipment Fully Automatic High Precision 12 Suction Nozzles 24 Gel Boxes Multiple Chips Die Bonder Die Bonding Eutectic Crystal Planting Machine
US$170,000.00-190,000.00
1 Set
Product profile
Customization
AvailableAfter-sales Service
1 YearCondition
NewModel NO.
MDSpeed
High SpeedPrecision
High PrecisionCertification
CEWarranty
12 MonthsAutomatic Grade
AutomaticType
High-speed Chip MounterTransport Package
Wooden CaseTrademark
minder-hightechOrigin
ChinaProduction Capacity
1000Key features
High Precision Positioning: Achieves +/-3um positioning accuracy with 1um high precision exploration capability.
High Speed Production: Efficient mounting speed with a production capacity of over 1500 components per hour.
Advanced Nozzle System: Equipped with 12 suction nozzles and 24 gel boxes for flexible multi-chip bonding.
Flexible Configuration: Modular design allows flexible combination, cascading, and online integration with dispensing machines.
Smart Monitoring: Real-time monitoring of working status, material, and nozzle application via secondary display.
Wide Application Scope: Suitable for microwave, millimeter wave, hybrid IC, discrete devices, and optoelectronics fields.
Precision Dispensing: Minimum glue point diameter reaches 0.2mm with automatic dispensing and calibration control.
Easy Operation: Convenient programming and easy learning process effectively shorten personnel training cycles.
Company profile
Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤8.62h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW
About Our Factory & Business Background
AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2014-12-30
Main MarketsNorth America, Europe
Overseas Agent/BranchNo
Product Q&A
Q:What is the warranty period for the equipment?
A:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.
Q:How does the payment process work?
A:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.
Q:Is sample production service available?
A:
We can provide sample production services for you, but you may provide some fees.
Q:What is the delivery and inspection process?
A:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.
Q:Do you provide installation and debugging services?
A:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.
Send Inquiry
*To:Guangzhou Minder-Hightech co.,Ltd
Guangzhou Minder-Hightech co.,Ltd*Content:
Supplier replies will be sent to your registered email
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