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Advanced Automated Dicing System for 300mm Semiconductor Wafers
US$50,000.00-100,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
ProvidedWarranty
12 MonthModel NO.
ML320Application
Environmental Equipment, Aerospace Industry, Automotive IndustryCooling System
Air CoolingTechnical Class
Pulse LaserApplicable Material
NonmetalStructure Type
DesktopLaser Classification
Semiconductor LaserLaser Technology
Laser Control Fault CuttingWafer Size
300mmProcessing Method
Contactless DicingSurface Protection
No Damage to Silicon Wafer SurfaceDevice Compatibility
Ideal for Mems DevicesWafer Thickness Adaptability
Supports Broad Range (Thin to Thick Wafers)Yield & Cost Advantage
Narrow Dicing Scribe Width (Down to 20um)Productivity (Throughput)
High-Speed Dicing (≥800 mm/Sec)Optional Features
Device Internal Clean (Class 100) SpecificationKey Traits
Damage-Free, Dry-Process CompatibleTransport Package
Wooden PackageSpecification
3000kgTrademark
1, 712 mm × 2, 960 mm × 1, 800 mmOrigin
ChinaHS Code
8541590000Production Capacity
200Key features
Contactless Dicing Technology: No damage to silicon wafer surface with a completely dry process.
High-Speed Throughput: Achieves dicing speeds of 800 mm/sec or greater.
300mm Wafer Compatibility: Supports maximum wafer diameter of 300mm.
Enhanced Yield Efficiency: Narrow scribe width down to 20um increases yield by 20%.
Broad Thickness Adaptability: Supports a wide range from thin to thick wafers.
MEMS Device Compatibility: Ideal for MEMS devices requiring no water or processing load.
Class 100 Clean Option: Optional device internal clean specification available.
OEM and ODM Services: Flexible customization options for OEM and ODM requirements.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.36h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What is the maximum wafer size supported?
A:
The machine supports a maximum wafer diameter of 300mm.
Q:Does the machine support thin and thick wafers?
A:
Yes, it supports a broad range of thicknesses by adjusting the number of processing scans.
Q:What is the dicing speed of the machine?
A:
It offers high-speed dicing of 800 mm/sec or greater.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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