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Advanced Automated Wafer Handling System for Maximum Efficiency
US$50,000.00-100,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
Free TrainingWarranty
One Year ServiceModel NO.
HM-01Application
Home Appliance, Environmental Equipment, Petroleum Machinery Manufacturing, Agriculture Machinery, Textile Machinery, Food Machinery, Aerospace Industry, Automotive Industry, Shoemaking Industry, Woodwork IndustryCooling System
Water CoolingTechnical Class
Pulse LaserApplicable Material
MetalStructure Type
Gantry TypeLaser Classification
Semiconductor LaserLaser Technology
Laser Control Fault CuttingWafer Compatibility
Suitable for Wafer Transfer of 300mm and BelowTrajectory Function
Can Realize Free End Trajectory and Oblique InsertManipulator Cup Type
Single Arm (Anti-Fog)Manipulator Arm Model
Rb100swpControl Axis
3Power Supply
AC 220V 2.2A VacuumWeight
40kgWafer Support
300mm and Smaller Wafers (200mm, 150mm)Transport Package
Packed with Wooden Box by Sea ShippingSpecification
1500kgTrademark
HimalayaOrigin
ChinaProduction Capacity
5000Key features
High-Precision Handling: Ensures contamination-free transfer of wafers up to 300mm in cleanroom environments.
Flexible Trajectory: Realizes free end trajectory and oblique insertion for complex handling tasks.
Anti-Fog Design: Single-arm manipulator with anti-fog design to minimize contamination risks.
Wide Compatibility: Supports 300mm, 200mm, and 150mm wafers for versatile semiconductor applications.
Compact Structure: Gantry type structure with approx. 40kg weight, suitable for various factory layouts.
Free Training: Complimentary training services included with the purchase of the system.
One-Year Warranty: Provides one year of service warranty for peace of mind and reliability.
Multi-Industry Use: Applicable in semiconductor, aerospace, automotive, and medical device manufacturing.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.36h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:What is a wafer automatic transfer system?
A:
A wafer automatic transfer system is a robotic handling system used in semiconductor manufacturing to automatically transport wafers between processing equipment, load ports, and storage cassettes while maintaining high precision, cleanliness, and speed.
Q:What wafer sizes does this system support?
A:
The system supports 300mm and smaller wafers (e.g., 200mm, 150mm).
Q:Where is this system commonly used?
A:
It is used in: Semiconductor fabrication plants (fabs), Wafer inspection systems, Vacuum process chambers, and Research & development labs.
Q:What is the warranty period for this equipment?
A:
We provide a one-year service warranty for the wafer automatic transfer system.
Q:Does the system include training services?
A:
Yes, free training is provided as part of our after-sales service.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
Supplier replies will be sent to your registered email
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