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Advanced Green Laser Dicing System for Sic Wafer Cutting
US$50,000.00-200,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
ProvidedWarranty
12 MonthsModel NO.
GLC-01Application
Home Appliance, Environmental Equipment, Automotive IndustryCooling System
Air CoolingTechnical Class
Continuous Wave LaserApplicable Material
MetalStructure Type
Gantry TypeLaser Classification
Free Electron LaserLaser Technology
Laser Control Fault CuttingLaser Source
532nm Green Laser, 30WMotion System
Linear Motors (X/Y-Axis: 200mm) + Ball Screw Z-AxiVision System
Custom CCD Monitoring SystemControl System
Ky-Urcutting Motion Control SoftwareDimensions
1410 × 1350 × 2070mmWeight
1090kgMaterials
Brittle Materials, High-Hardness MetalsProcessing Area
150×150mmCutting Precision
±0.05mmTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaKey features
Specialized Laser Source: Uses 532nm Green Laser (30W) for minimal thermal impact on brittle materials.
Advanced Motion System: Equipped with Linear Motors and Ball Screw for high-precision control.
Customizable Processing: Supports custom dimensions, fixtures, and CCD monitoring systems.
Stable Marble Base: Marble platform ensures vibration-free operation for consistent quality.
Versatile Applications: Ideal for electronics, medical devices, ceramics, and glass processing.
Comprehensive Warranty: Provides 12-month standard warranty with extended service options.
Professional Support: Offers pre-sales consultation and after-sales technical maintenance.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.36h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:What materials can this laser cutter process?
A:
It is suitable for brittle materials, high-hardness metals, thermal-sensitive substrates, ceramics, diamonds, and glass.
Q:Is customization available for this machine?
A:
Yes, customization is supported for dimensions, fixtures, and the CCD monitoring system.
Q:What is the warranty period?
A:
We provide a 12-month warranty with extended service options available.
Q:What is the lead time for orders?
A:
The lead time is 1-3 months during the off-season and 3-6 months during the peak season.
Q:What are the payment terms?
A:
We accept LC, T/T, PayPal, and Western Union.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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