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Advanced Automated Wafer Sorting Machine with Smart Features
US$50,000.00-70,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
YesCondition
NewModel NO.
ASW6300Speed
High SpeedPrecision
PrecisionCertification
CCC, ISOWarranty
12 MonthsAutomatic Grade
AutomaticType
High-speed Chip MounterPower
220VFrequency
50HzInstallation
DesktopDriven Type
Electric + PneumaticControl System
User-Friendly Touch Screen & Teaching PendantKey Strength
High-Rigidity Aluminum Alloy StructureTransport Package
Wooden PackageSpecification
2489× 1397× 2215mmTrademark
HimalayaOrigin
ChinaHS Code
9030820000Production Capacity
150Key features
Precision Dispensing: Achieves pinpoint accuracy in volume, speed, and pathing via high-precision motors.
SECS/GEM Communication: Features standard SECS/GEM interface for seamless integration into existing lines.
Versatile Wafer Handling: Supports 4'-12' wafers with customizable load ports and gripping mechanisms.
User-Friendly Control: Equipped with an intuitive touch screen and teaching pendant for quick setup.
Compact Desktop Design: Space-saving structure integrates easily into diverse production environments.
Multi-Industry Application: Ideal for PCB, chip encapsulation, LCD screens, and consumer electronics bonding.
Flexible Customization: Offers OEM/ODM services and customizable wafer sizes and configurations.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.14h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:Why choose us?
A:
OEM/ODM/Designing service.
Q:What wafer sizes are compatible?
A:
The machine is compatible with 4' to 12' standard wafers, or customizable for closely related sizes.
Q:What communication interfaces are supported?
A:
It supports standard SECS/GEM or simplified networking protocols.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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