Precision Si/Sic Wafer Cutting Machine with Smart Technology

Name: Precision Si/Sic Wafer Cutting Machine with Smart Technology
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 1962736991

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$90,000.00-1,500,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

Yes

Condition

New

Model NO.

HM001

Speed

High Speed

Precision

High Precision

Warranty

12 Months

Automatic Grade

Automatic

Type

High-speed Chip Mounter

Transport Package

Air Freight

Trademark

Himalaya

Origin

China

Production Capacity

200

Key features

Dual LiDAR Navigation: Equipped with dual LiDAR for autonomous navigation and 360-degree safe obstacle avoidance.

Flexible Customization: Offers flexible customization options including OEM and ODM services to match specific needs.

System Integration: Integrates seamlessly with customer MES systems for flexible scheduling and rapid deployment.

Multi-Industry Application: Suitable for diverse industries including 3C, automotive, new energy, aerospace, and medical care.

High Efficiency Operation: Autonomous material transport reduces worker workload and improves enterprise efficiency.

Smart Scheduling Control: Features a scheduling control system enabling multiple trolleys to work simultaneously.

Comprehensive Inspection: 100% inspection of finished products including visual and function checks before packing.

Global Trade Terms: Accepts various payment methods including LC, T/T, and PayPal with FOB, CIF, CFR, EXW terms.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.77h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.