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Advanced Semiconductor Packaging Equipment Accuracy 1um Gantry Multi Needle Nozzle Replacement Die Sorter Die Sorting Attach Machine
US$170,000.00-190,000.00
1 Set
Product profile
Customization
AvailableAfter-sales Service
1 YearCondition
NewModel NO.
MDSpeed
High SpeedPrecision
High PrecisionCertification
CEWarranty
12 MonthsAutomatic Grade
AutomaticType
High-speed Chip MounterTransport Package
Wooden CaseTrademark
minder-hightechOrigin
ChinaProduction Capacity
1000Key features
High Precision Accuracy: Achieves positioning accuracy of +/-3um and probing accuracy of 1um for high-precision semiconductor packaging.
High-Speed Production: Efficient mounting speed with a production capacity of over 1500 components per hour for 0.5*0.5mm chips.
Advanced Dispensing System: Equipped with precision dispensing control, minimum glue point diameter reaches 0.2mm with high compatibility.
Flexible Configuration: Features 12 suction nozzles and 24 gel boxes, supporting multi-chip bonding and diverse configuration methods.
Smart Monitoring & Control: Real-time status monitoring via second display, automatic calibration, and support for CAD import and SMEMA communication.
Wide Application Scope: Suitable for microwave, millimeter wave, hybrid IC, discrete devices, and optoelectronics fields.
Reliable Warranty Support: Comes with a 12-month warranty, with cost-price replacement parts available after the warranty period.
One-Stop Solution Provider: Minder-Hightech offers superior, reliable, and one-stop solutions for semiconductor and electronic equipment since 2014.
Company profile
Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤8.62h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW
About Our Factory & Business Background
AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2014-12-30
Main MarketsNorth America, Europe
Overseas Agent/BranchNo
Product Q&A
Q:What is the warranty period for the equipment?
A:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.
Q:How does the pricing work for this machine?
A:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.
Q:Can you provide sample production services?
A:
We can provide sample production services for you, but you may need to pay some fees.
Q:What is the payment term for the order?
A:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.
Q:How is the delivery and inspection handled?
A:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.
Send Inquiry
*To:Guangzhou Minder-Hightech co.,Ltd
Guangzhou Minder-Hightech co.,Ltd*Content:
Supplier replies will be sent to your registered email
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