Is OEM/ODM service available?

Yes, OEM/ODM service is provided with flexible customization options.

What certifications does the machine have?

The machine is certified with ISO and CE standards.

Advanced UV Laser Annealing System for High-Performance Bsi CCD Manufacturing

Name: Advanced UV Laser Annealing System for High-Performance Bsi CCD Manufacturing
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2081341982

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$100,000.00-200,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

Free Training

Function

High Temperature Resistance

Model NO.

WCD-1202

Demoulding

Pull Core

Condition

New

Certification

ISO, CE

Warranty

12 Months

Automatic Grade

Automatic

Installation

Vertical

Driven Type

Electric

Mould Life

<300,000 Shots

Product Name

Sic Laser Annealing La

Feature 1

High Reliability and Stability

Feature 2

Independly Developped Optical System

OEM/ODM Service

Provided

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Production Capacity

50000

Key features

Independent Optical System: Independently developed optical system with LIET technology for high reliability.

Dual Wavelength Options: IP Green and UV laser wavelengths are optional for precise energy density control.

High Reliability: First domestic green laser machine for mass production with stable performance.

Flexible Customization: OEM/ODM services provided with flexible customization options available.

Certified Quality: Equipment certified with ISO and CE standards for safety and quality assurance.

Comprehensive Warranty: 12 months warranty with 24 hours online professional technical support.

Free Training: Free training included with after-sales service for smooth operation.

Precise Control: Precise energy density control for Bsi-CCD wafer manufacturing applications.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.93h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.

Q:What are the available laser wavelengths?

IP Green and UV laser two wavelengths are optional.

Q:What is the maximum laser energy density?

Green: 10J/cm2, UV: 6J/cm2.

Q:What wafer sizes are supported?

6 inch and 8 inch wafer sizes are supported.