Powered by Made-in-China.com
Advanced High-Precision Die Attach Bonder for Semiconductor Manufacturing
US$100,000.00-1,000,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
ProvidedCondition
NewModel NO.
JH-01Speed
High SpeedPrecision
High PrecisionCertification
ISOWarranty
12 MonthsAutomatic Grade
AutomaticProduct Name
Semiconductor EquipmentFeature 1
Guaranteed QualityFeature 2
Customized According to NeedsAfter-Sale Service
ProvidedTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaCompany profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.54h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
Supplier replies will be sent to your registered email
You may also like
High Precision Automatic Die Bonder for Advanced COB Applications
US$100,000.00-1,000,000.00
1 Piece(MOQ)
High Precision Asm Die Bonder Ad819 Dispensing Equipment for Semiconductor Packaging Solutions
US$10,000.00-1,000,000.00
1 Set(MOQ)
Gkg Gd80+C Automatic Precision Die Bonder Lightweight Dual Swing Arm for LED & Semiconductor
US$12,500.00-38,000.00
1 Piece(MOQ)
Advanced High-Speed Linear Die Bonder for Lead Frame Assembly Solutions
US$100,000.00-1,000,000.00
1 Piece(MOQ)
Semiconductor High Precision Asmpt Siplace Ca2 Plus Die Bonding and Flip Chip Placement Bonder
US$100,000.00-1,000,000.00
1 Set(MOQ)
High-Precision SMD LED COB Die Bonder for Advanced Assembly
US$100,000.00-1,000,000.00
1 Piece(MOQ)
Small Semiconductor Die Bonding System, Wafer Die Attach Eutectic Bonder dB100
US$90,500.00-119,000.00
1 Piece(MOQ)
High Precision R&D Using Small Die Bonder Can Reach Die Bonder, Soldering and Glue Dispensing
US$90,500.00-119,000.00
1 Piece(MOQ)
Mdnd-Adb700 High-Speed High Precision Stacked Chips Advanced Semiconductor Packaging Die Bonder
US$150,000.00-200,000.00
1 Piece(MOQ)
High-Precision Linear Die Bonder for Optimal Bonding Performance
US$100,000.00-1,000,000.00
1 Piece(MOQ)
New Brand Asm Ad830 Plus Semiconductor Equipment Asmpt Die Bonder
US$100,000.00-1,000,000.00
1 Set(MOQ)
Small High Precision Pick and Place Machine Flip Chip Die Bonder dB100
US$90,500.00-119,000.00
1 Piece(MOQ)
Gkg Gd210 Precision Die Bonder - 10-Inch Auto Wafer Ring Changer & Film Expander for 600×510mm Large Substrate Semiconductor Packaging
US$22,500.00-48,000.00
1 Piece(MOQ)
Desktop Die Bonder High-Precision Manual-Semi-Automatic dB100
US$90,500.00-119,000.00
1 Piece(MOQ)
Gkg Gd91m6 Multi-Station Die Bonder High Accuracy for Display Module Manufacturing
US$32,500.00-38,000.00
1 Piece(MOQ)
Semicon Equipment Advanced Packaging Line Desktop High Precision Multifunction Dispensing Dispenser and Die Attach Chip Bonder
US$116,000.00-150,000.00
1 Piece(MOQ)
Used China High-Precision Semiconductor Equipment Asm Ad211 Plus Flip Chip Bonder
US$100,000.00-1,000,000.00
1 Set(MOQ)
High-Precision Back-End Semiconductor Equipment Supplier Used Newport Mrsi-705 Die Bonder
US$490,000.00-660,000.00
1 Piece(MOQ)
Ad832I Fully Automatic Asm Die Bonding Machine, Semiconductor Die Bonder for IC Packaging Production
US$100,000.00-120,000.00
1 Piece(MOQ)







