Powered by Made-in-China.com
High Precision Automatic Die Bonder for Advanced COB Applications
US$100,000.00-1,000,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
YesCondition
NewModel NO.
DB001Speed
High SpeedPrecision
High PrecisionWarranty
12 MonthsAutomatic Grade
AutomaticType
High-speed Chip MounterTransport Package
Air FreightTrademark
HimalayaOrigin
ChinaProduction Capacity
200Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.06h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
You may also like
Advanced Precision Die Bonder for Qfp, Lqfp, and Qfn Applications
US$100,000.00-1,000,000.00
1 Piece(MOQ)
Precision Die Attachment Eutectic Wafer Bonder for Advanced Applications
US$100,000.00-1,000,000.00
1 Piece(MOQ)
High Precision Asm Die Bonder Ad819 Dispensing Equipment for Semiconductor Packaging Solutions
US$10,000.00-1,000,000.00
1 Set(MOQ)
Gkg Gd80+C Automatic Precision Die Bonder Lightweight Dual Swing Arm for LED & Semiconductor
US$12,500.00-38,000.00
1 Piece(MOQ)
High-Speed Precision LED COB Die Bonder for Assembly
US$100,000.00-1,000,000.00
1 Piece(MOQ)
Desktop High Precision Semi-Automatic Die Bonder Crystal Bondering Machine Db100
US$90,500.00-119,000.00
1 Piece(MOQ)
Semi Automatic Flip Chip Die Bonder Semiautomatic with High Precision Termway
US$90,500.00-119,000.00
1 Piece(MOQ)
High-Precision Linear Die Bonder for Superior Bonding Efficiency
US$100,000.00-1,000,000.00
1 Piece(MOQ)
China Used Besi Datacon 8800 FC Quantum Advx Manufactures Automatic Ball Wire Flip Chip Wedge Die Bonder
US$158,000.00-259,500.00
1 Piece(MOQ)
Mdnd-Adb700 High-Speed High Precision Stacked Chips Advanced Semiconductor Packaging Die Bonder
US$150,000.00-200,000.00
1 Piece(MOQ)
Semicon Equipment Advanced Packaging Line Desktop High Precision Multifunction Dispensing Dispenser and Die Attach Chip Bonder
US$116,000.00-150,000.00
1 Piece(MOQ)
Desktop Die Bonder High-Precision Manual-Semi-Automatic dB100
US$90,500.00-119,000.00
1 Piece(MOQ)
Gkg Gd91m2 Precision Die Bonder - Dual Arm 180° Rotation Die Bonding Equipment for Backlight & Direct Display
US$12,500.00-38,000.00
1 Piece(MOQ)
High Precision R&D Using Small Die Bonder Can Reach Die Bonder, Soldering and Glue Dispensing
US$90,500.00-119,000.00
1 Piece(MOQ)
Gkg Gd601d Full-Automatic High-Speed Die Bonder - 180° Cross Bonding, in-Line Sheet-to-Sheet Transfer
US$32,500.00-58,000.00
1 Piece(MOQ)
Asm Semiconductor Equipment Manufacturers Cm Linda Automatic Bonding Machine Supplier Die Bonder
US$100,000.00-1,000,000.00
1 Set(MOQ)
Asm Semiconductor Equipment Supplier Bonding Machine Manufacturers CB832 Automatic Die Bonder
US$100,000.00-1,000,000.00
1 Set(MOQ)
KOH Young Automatic Optical Inspection 3D Spi Online Machine for PCB SMT Assembly Die Bonder
US$80,000.00
1 Piece(MOQ)
Gkg High-Speed Die Bonder Series: Flexible Sheet/Tape Model & Full-Automatic Gd602D - 180° Cross Bonding, in-Line
US$32,500.00-58,000.00
1 Piece(MOQ)
Used Automatic Semiconductor Die Bonding Equipment Besi Datacon 8800 Chameo Advanced Wedge Wire Bonder
US$294,000.00-440,000.00
1 Piece(MOQ)