Powered by Made-in-China.com
Mdnd-Adb700 High-Speed High Precision Stacked Chips Advanced Semiconductor Packaging Die Bonder
US$150,000.00-200,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
2 YearCondition
NewModel NO.
MDND-ADB700Speed
High SpeedPrecision
High PrecisionCertification
CEWarranty
24 MonthsAutomatic Grade
AutomaticType
Ultra High-speed Chip MounterAccuracy
±7um@3σCph
2400(1s)Transport Package
Wooden CartonTrademark
minder-hightechOrigin
ChinaCompany profile
Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤6.03h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW
AI-Powered supplier vetting
SummaryGuangzhou Minder-Hightech Co., Ltd, established in 2014 in Guangdong, China, operates as a trading company with a focus on industrial equipment and components. Despite being a limited company with only 10 employees, it has maintained a strong relationship with high-profile companies like Bosch and Apollo, suggesting robust industry connections. The company exports a significant portion of its products to Europe and North America, which constitutes 41-50% of its total sales. However, it lacks formal certification in supplier management systems and has limited R&D resources. With an annual production output of approximately US$1-2.5 million, it operates eight production lines but does not hold certifications, which could be a limitation in quality assurance.
Supplier typeGuangzhou Minder-Hightech Co., Ltd is classified as a trading company and operates as a limited company.
CertificationsThe company does not hold any certifications for supplier management systems.
R&D capabilityDespite being a relatively new company, it claims over 20 years of experience in welding technology and maintains relationships with high school scientific research institutions.
Production capacityThe company operates eight production lines with a total manufacturing area of 260.0m² and an annual production output between US$1-2.5 million.
Client casesThe company has collaborated with prominent firms such as Bosch and Apollo, indicating established customer cases.
Send Inquiry
*To:Guangzhou Minder-Hightech co.,Ltd
Guangzhou Minder-Hightech co.,Ltd*Content:
Supplier replies will be sent to your registered email
You may also like
Advanced High Precision Die Bonder for 6" to 8" Semiconductor Manufacturing
US$100,000.00-1,000,000.00
1 Piece(MOQ)
Advanced High-Precision Die Attach Bonder for Semiconductor Manufacturing
US$100,000.00-1,000,000.00
1 Piece(MOQ)
Semiconductor Packaging Testing Equipment Supplier Manufacturers YAMAHA Ysh20 Flip Chip Mounter Bonder
US$100,000.00-1,000,000.00
1 Set(MOQ)
Semicon Equipment Advanced Packaging Line Desktop High Precision Multifunction Dispensing Dispenser and Die Attach Chip Bonder
US$116,000.00-150,000.00
1 Piece(MOQ)
High Precision Asm Die Bonder Ad819 Dispensing Equipment for Semiconductor Packaging Solutions
US$10,000.00-1,000,000.00
1 Set(MOQ)
High Precision Flip Chip Die Bonder dB100 Termway
US$90,500.00-119,000.00
1 Piece(MOQ)
Advanced Precision Automatic Clip Chip Bonder for Semiconductor Production
US$10,000.00-100,000.00
1 Piece(MOQ)
Semi Automatic Flip Chip Die Bonder Semiautomatic with High Precision Termway
US$90,500.00-119,000.00
1 Piece(MOQ)
Gkg Gd210 Precision Die Bonder - 10-Inch Auto Wafer Ring Changer & Film Expander for 600×510mm Large Substrate Semiconductor Packaging
US$22,500.00-48,000.00
1 Piece(MOQ)
Factory Direct Sales Asm High Speed LED Clip Wafer Die Bonder Ad50PRO
US$100,000.00-1,000,000.00
1 Set(MOQ)
Semiconductor Packaging Die Bonder Bonding Machine Eutectic Crystal Planting Machine
US$50,000.00-100,000.00
1 Piece(MOQ)
High Precision Desktop Chip Die Bonder dB100 Series
US$90,500.00-119,000.00
1 Piece(MOQ)
Automatic Semiconductor Soft Solder Bonding Die Attach Solution SD800 Die Bonder
US$7,000.00-70,000.00
1 Piece(MOQ)
Desktop High Precision Semi-Automatic Die Bonder Crystal Bondering Machine Db100
US$90,500.00-119,000.00
1 Piece(MOQ)
Gkg Gd80+C Automatic Precision Die Bonder Lightweight Dual Swing Arm for LED & Semiconductor
US$12,500.00-38,000.00
1 Piece(MOQ)
China Used Besi Datacon 8800 FC Quantum Advx Manufactures Automatic Ball Wire Flip Chip Wedge Die Bonder
US$158,000.00-259,500.00
1 Piece(MOQ)
Gkg High-Speed Flexible Tape Die Bonder with Precision Dispensing & Auto Film Expanding
US$12,500.00-38,000.00
1 Piece(MOQ)
Advanced Wire Bonder for Precision Electronics Assembly and Repair
US$72,000.00
1 Piece(MOQ)
Used Combines Speed Precision Stability Automatic Semiconductor Equipment Asm Die Bonding Machine Ad8312 K&S Wedge Wire Bonder
US$29,000.00-58,800.00
1 Piece(MOQ)