What is the lead time for production?

Peak season lead time is 3-6 months, while off-season lead time is 1-3 months.

What is the applicable wafer size range?

The machine supports wafer sizes from 100mm to 200mm.

Does the machine support customization?

Yes, we offer flexible customization and OEM/ODM services.

Advanced Semiconductor Wafer Grinding System for Precision Tasks

Name: Advanced Semiconductor Wafer Grinding System for Precision Tasks
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2087558752

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$500,000.00-1,000,000.00

1 Set

Product profile

Customization

Available

After-sales Service

Online Service

Function

High Temperature Resistance

Model NO.

HM-0260

Demoulding

Automatic

Condition

Used

Certification

ISO

Warranty

12 Months

Automatic Grade

Automatic

Installation

Desktop

Driven Type

Electric

Mould Life

>1,000,000 Shots

Product Name

Wafer Back Grinding Equipment

Feature 1

Guaranteed Quality

Feature 2

Customized According to Needs

OEM/ODM Service

Provided

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Key features

Full-Automatic Operation: Equipped with wafer level handling robot and fool-proofing system for efficient processing.

Stable Vacuum System: Features water ring vacuum pump ensuring stable vacuum and minimal vibration.

Customized Chuck Table: Ultra-precision chuck table base adaptable to different hardness of wafer materials.

Visual Management System: Integrated visual system for real-time monitoring of the grinding process.

Flexible Customization: OEM/ODM services provided with customized features according to specific needs.

Long Mould Life: Designed for durability with a mould life exceeding 1,000,000 shots.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.36h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.

Q:Why choose us?

OEM/ODM Designing.

Q:What is the minimum order quantity?

The minimum order quantity is 1 Set.

Q:What are the payment terms?

We accept LC, T/T, PayPal, and Western Union.