What is the average lead time?

Peak season lead time is 3-6 months, while off-season lead time is 1-3 months.

What customization options are available?

Flexible customization is available, including OEM and ODM services.

Advanced UV Laser Annealing System for Bsi-CCD & Sic Wafers

Name: Advanced UV Laser Annealing System for Bsi-CCD & Sic Wafers
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2082625222

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$70,000.00-100,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

7*24 Hours

Function

Abrasion Resistance, High Temperature Resistance, Anti-Corrosion

Model NO.

SUV-1031

Demoulding

Automatic

Condition

New

Certification

RoHS, ISO, CE

Warranty

12 Months

Automatic Grade

Automatic

Installation

Vertical

Driven Type

Electric

Mould Life

<300,000 Shots

Wafer Size Compatibility

6 Inch, 8 Inch

Junction Depth

≤50nm (Ultra-Shallow)

Impurity/Dopant Diffusion

≤5nm Peak Diffusion Depth

Process Uniformity

Sheet Resistance (RS) Non-Uniformity < 2%

Thermal Management

Non-Annealed Surface Temperature < 120°C

Laser Source

UV Laser

Beam Profile

1d Top Hat Beam

Beam Characteristic

Large Length/Width Ratio

Annealing Head

Customized Laser Annealing Head

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Key features

First Domestic 8-Inch LA Equipment: China's first mass-production 8-inch ultra-shallow dopant laser annealing system for BSI-CCD and SiC.

SEMI Certified Standards: Fully certified for the semiconductor industry with a standard EFEM front-end system.

Customized Laser Annealing Head: Features a specialized head designed to anneal entire SiC wafer backside metal layers efficiently.

High Process Uniformity: Sheet resistance non-uniformity is strictly controlled to less than 2%.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.50h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.

Q:Why choose us?

OEM/ODM Designing

Q:What wafer sizes are compatible?

The equipment supports 6-inch and 8-inch wafer sizes.

Q:What are the main applications?

It is designed for ultra-shallow dopant activation in BSI-CCD and superior ohmic contact formation for SiC and compound semiconductors.