Advanced Wafer Back Grinding System with Smart Scanning Tech

Name: Advanced Wafer Back Grinding System with Smart Scanning Tech
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2127104445

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$500,000.00-1,000,000.00

1 Set

Product profile

Customization

Available

After-sales Service

Provided

Function

High Temperature Resistance

Demoulding

Automatic

Condition

Used

Certification

ISO

Warranty

12 Months

Automatic Grade

Automatic

Installation

Desktop

Driven Type

Electric

Mould Life

>1,000,000 Shots

Product Name

Wafer Back Grinding Equipment

Feature 1

Guaranteed Quality

Feature 2

Customized According to Needs

OEM/ODM Service

Provided

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Key features

Smart Scanning System: Equipped with material information scanning and input system for precise identification.

Wafer Level Handling Robot: Automated robot ensures efficient and safe wafer level handling during the process.

Fool-proofing System: Identifies the positive and negative side of the wafer to prevent errors.

Stable Vacuum Performance: Water ring vacuum pump ensures stable vacuum and minimal vibration.

Visual Management System: Provides visual management for the grinding process to enhance monitoring.

Customized Ultra-Precision Chuck: Adapts to different hardness of wafer materials with excellent performance.

Wide Wafer Size Compatibility: Applicable for wafer sizes ranging from 100mm to 200mm.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.50h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.