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Automatic High Precision Semiconductor Die Bonding Machine for Electronics Production
US$70,000.00-120,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
YesCondition
NewModel NO.
DB001Speed
High SpeedPrecision
High PrecisionCertification
RoHS, ISO, CEWarranty
12 MonthsAutomatic Grade
AutomaticType
High-speed Chip MounterProduct Name
COB Smart Die Bonding MachineHigh Placement Accuracy
+/- 50um @3σTheta Placement Accuracy
+/- 3° @3σHigh Throughput
up to 20 Clips / CycleAutomation Level
Fully Automatic Loading & UnloadingTarget Products
SMD, 1W & High-Power COB Surface Light SourcesPin Processing Capability
Ultra-Long Pin (65ms)Minimum Chip Size
5 Mil (127 Micrometers)Transport Package
Air FreightSpecification
1500kgTrademark
HimalayaOrigin
ChinaProduction Capacity
200Key features
High Placement Accuracy: Achieves +/- 50um @3sigma placement accuracy for clips.
High Throughput Speed: Processes up to 20 clips per cycle with a 180ms bond cycle.
Ultra-Long Pin Processing: Capable of processing ultra-long pins up to 65mm in length.
Small Chip Capability: Handles minimum chip sizes as small as 5 mil (127 micrometers).
Integrated Solder Inspection: Includes solder patch and paste inspection to prevent defects.
Flexible Customization: Supports OEM/ODM and flexible configuration customization.
Multi-Dispensing Control: Independent control system for precise adhesive application.
Patented Head Design: Features a brand-new tying head for accurate positioning.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤0.01h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:Why choose us?
A:
OEM/ODM/Designing.
Q:What is the placement accuracy of the clip bonder?
A:
The placement accuracy is +/- 50um @3sigma, and theta placement accuracy is +/- 3 degrees @3sigma.
Q:What is the throughput capacity per cycle?
A:
The system can process up to 20 clips per cycle.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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