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Precision Automatic Eutectic Flip Chip Die Bonding Machine for IC Packaging
US$7,000.00-70,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
Free TrainingCondition
NewModel NO.
HMLY-DB-005Speed
Super High SpeedPrecision
High PrecisionCertification
RoHS, CEWarranty
24 MonthsAutomatic Grade
AutomaticType
Ultra High-speed Chip MounterConfiguration
Inline or StandaloneCommunication
TCP/IPPower Supply
220VChip Size Range
0.8 to 25 mmWafer Support
8 Inch / 12 InchSubstrate/Leadframe Width
30 To120 mmSubstrate/Leadframe Length
150 to 300 mmBond Force Range
30 GF to 4000 GFMachine Dimensions (W×D×H)
2170 mm × 1450 mm × 1800 mmWeight
1800kgTransport Package
Wooden Box by Sea ShippingSpecification
standard packageTrademark
HimalayaOrigin
ChinaProduction Capacity
5000Key features
Ultra High-Speed Performance: Achieves over 3000 units per hour with high precision placement accuracy.
Advanced Flip-Chip Technology: Supports C4 and micro-bump bonding for 3D heterogeneous integration.
Flexible Configuration Options: Available in Inline or Standalone configurations with TCP/IP communication.
Comprehensive Warranty Coverage: Standard 24-month warranty with optional extended coverage up to 36 months.
Global After-Sales Support: 24/7 technical assistance, spare parts supply, and on-site training available.
Wide Chip Size Compatibility: Supports chip sizes ranging from 0.8 mm to 25 mm and wafer sizes up to 12 inches.
OEM and ODM Services: Tailored solutions and flexible customization for unique production needs.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.86h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:Do you provide after-sales service overseas?
A:
Yes, we have partnered service centers in key regions.
Q:Can I request a customized size?
A:
Absolutely! We offer tailored attachments.
Q:What documents do you provide for export?
A:
Full export package (Commercial Invoice, Packing List, Bill of Lading, COC, etc.).
Q:How do I place an order?
A:
Contact us via email/phone for a quote, then confirm with a PO.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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