Powered by Made-in-China.com
High Speed Precision Automatic Semiconductor Equipment IC Package Wafer Die Bond Die Bonding Attach Eutectic Crystal Planting Machine
US$50,000.00-99,999.00
1 Piece
Sample price:US$100.00/piece.Request sample
Product profile
Customization
AvailableAfter-sales Service
1 YearCondition
NewModel NO.
MD-JC360-D MD-JC380-DSpeed
High SpeedPrecision
PrecisionCertification
CEWarranty
12 MonthsAutomatic Grade
AutomaticType
High-speed Chip MounterTrademark
minder-hightechOrigin
ChinaProduction Capacity
100Key features
High-Speed Bonding: Fast die bond cycle up to 180ms with patented head binding for stable operation.
Flexible Configuration: Modular design allows flexible choice of crystal rings, dispensing heads, and brackets.
Small Chip Capability: Capable of processing 5mil small chips and ultra-long PINs (65ms) with various search methods.
Advanced Vision System: 256 gray image recognition with 1024*768 resolution and 0.7~4.5x optical rate.
1-Year Warranty: Comprehensive 12-month warranty coverage for all mechanical equipment defects.
Professional Support: Overseas engineers available for installation, debugging, and after-sales service.
One-Stop Solution: 16 years of experience providing complete IC Package Line Equipment solutions.
Company profile

Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤8.62h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW
About Our Factory & Business Background
AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2014-12-30
Main MarketsNorth America, Europe
Overseas Agent/BranchNo
Product Q&A
Q:What is the warranty period?
A:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.
Q:How is the payment structured?
A:
After the plan is confirmed, you need to pay a deposit first. After the equipment is ready, you pay the balance, and then we will ship it.
Q:Can you provide sample production?
A:
Yes, we can provide sample production services, but you may need to pay some fees.
Q:What is the delivery and inspection process?
A:
After manufacturing, we send an acceptance video. You can also come to the site to inspect the equipment before shipment.
Q:Do you provide installation and debugging services?
A:
Yes, after the equipment arrives at your factory, we can dispatch engineers to install and debug it. A separate quotation applies for this service fee.
Send Inquiry
*To:
Guangzhou Minder-Hightech co.,Ltd
Guangzhou Minder-Hightech co.,Ltd*Content:
Supplier replies will be sent to your registered email
You may also like
12inch Fully Automatic Soft Solder Die Bonding Machine Factory for Semiconductor Assembly
US$7,000.00-70,000.00
1 Piece(MOQ)
Panasonic Vm-102 Pick and Place Machine High-Speed SMD Chip Mounter for LED & PCB Assembly Original SMT Equipment
US$128,000.00-168,000.00
1 Piece(MOQ)
Advanced Semiconductor Packaging Multifunctional High Precision Thickness Minimum 50um Ultrathin Die Sorting Die Sorter Machine
US$120,000.00-149,000.00
1 Piece(MOQ)
Automatic High Precision Die Bonder Die Bonding Machine for COB Box to Tec Mems HDMI
US$140,000.00-220,000.00
1 Piece(MOQ)
Ra IC Automatic Programmer/Electronic High-Speed Chip Insertion Machine (0.3s/Chip, IPC-620 certified)
US$20,900.00-26,500.00
1 Set(MOQ)
High Precision Semiconductor Equipment Die Bonding Machine Fully Automatic
US$50,000.00-100,000.00
1 Piece(MOQ)
Automatic Ts20 SMT Assembly Line Machine: High-Speed SMD Chip Mounter & Placement Equipment
US$18,000.00-28,000.00
1 Piece(MOQ)
Panasonic Npm-D3a High Speed SMT Pick and Place Machine Automatic Precision SMD Chip Mounter for PCB Assembly Line
US$50,000.00-70,000.00
1 Piece(MOQ)
YAMAHA Yv88xg SMT Pick and Place Machine, High-Speed Full Automatic Chip Mounter for 0603~54mm Components, PCB Assembly Equipment
US$33,000.00-35,000.00
1 Piece(MOQ)
Electronic Products Machinery Automatic UV Conformal Coating Equipment for PCBA High Precision Coating Line Equipment
US$18,000.00-20,000.00
1 Piece(MOQ)
Semiconductor Equipment Wafer Sawing Mdxt-Vwm8 Automatic High-Precision Vacuum Wafer Mounter / Wafer Mounting Machine
US$9,999.00-99,999.00
1 Piece(MOQ)
Fully Automatic Juki Semiconductor Equipment Acf Chip Machine
US$82,500.00
1 Piece(MOQ)
Factory Direct High Speed Automatic LED Pick and Place Equipment Chip Mounter Machine Manufacturer in China
US$50,000.00-60,000.00
1 set(MOQ)
High Precision Die Bonding Machine for Semiconductor Chips
US$100,000.00-1,000,000.00
1 Piece(MOQ)
High-Speed Die Attach Machines for Efficient Chip Assembly
US$40,000.00-100,000.00
1 Piece(MOQ)
KOH Young 3D Aoi Automatic Semiconductor Equipment Online Inspection Machine
US$125,000.00
1 Piece(MOQ)











