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Custom Semiconductor Precision Trim Solutions for Advanced Manufacturing
US$100,000.00-1,000,000.00
1 Piece
Product profile
Customization
AvailableCondition
NewWarranty
12 MonthsAutomatic Grade
AutomaticInstallation
VerticalDriven Type
ElectricProduct Name
Auto Molding EquipmentFeature 1
Guaranteed QualityFeature 2
Customized According to NeedsOEM/ODM Service
ProvidedTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaKey features
Customized Solutions: Equipment customized according to specific needs for optimal performance.
High Precision & Stability: Uses imported raw materials and advanced equipment for high accuracy and stable performance.
Advanced Control System: PLC (Omron) control with touch screen interface displaying UPH/SPM counts.
Comprehensive Safety: Equipped with leakage protection, emergency stop, and sensor-protected protective doors.
Versatile Functionality: Supports cutting, bending, forming, and separation for SOP/SSOP packaging series.
High Speed Performance: Cutting speed 60-100 SPM and separation speed 40-60 SPM for efficient production.
Flexible Feeding System: Rotating double magazine feeding with automatic tube arrangement and bulk receiving.
Optional Upgrades: Available with CCD visual detection and MES system networking functions.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.22h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What are the main functions of this equipment?
A:
The equipment performs product cutting, bending, forming, and separation after plastic sealing, applicable to SOP/SSOP series.
Q:What is the cutting and separation speed?
A:
Cutting speed is 60-100 strokes per minute (SPM), and separation speed is 40-60 strokes per minute.
Q:Is OEM/ODM service available?
A:
Yes, OEM and ODM services are provided, and customization is available according to specific needs.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
Supplier replies will be sent to your registered email
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