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Smart Laminating Solutions for Optimizing Semiconductor Manufacturing Process
US$8,000.00-10,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
Online ServiceFunction
High Temperature ResistanceModel NO.
HM0016Demoulding
Pull CoreCondition
NewCertification
ISO, CEWarranty
12 MonthsAutomatic Grade
AutomaticInstallation
VerticalDriven Type
ManualMould Life
300,000-1,000,000 ShotsType
Manual/Benchtop LaminatorProcess
Pre-Cutting/Dicing Surface ProtectionOperation
Easy-to-Use, No Training RequiredSupported Materials
Wafers (Including Ultra-Thin) Glass SubstratesFilm Types
Blue, UV, Pet Backing, Oduble-Layer TapesWafer Size Capacity
6, 8 12 InchTransport Package
Air FreightSpecification
customizedTrademark
HimalayaOrigin
ChinaProduction Capacity
200Key features
Cost-Saving Film Design: Proprietary mechanism minimizes film waste, significantly reducing consumable costs over time.
Gentle Lamination: Air-flexible pressure roller and spring-loaded table protect fragile and ultra-thin substrates.
Easy Operation: Intuitive design allows immediate use with zero training required, streamlining workflow.
Compact Benchtop: Small footprint perfect for cleanrooms and environments where space is limited.
Wide Material Compatibility: Suitable for blue tape, UV tape, PET backing, and double-layer tapes on various substrates.
Heated Adaptive Table: Heated elastic table ensures optimal adhesion and accommodates wafers of different thicknesses.
Integrated Cutting: Equipped with circumferential and transverse knives for quick and clean film cutting.
Anti-Static Option: Optional ionizing bar removes static electricity to prevent dust attraction and improve yield.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.14h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:Is the machine automatic or manual?
A:
The manual film laminator series is designed for manual operation but features automatic substrate handling mechanisms for efficiency.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.
Q:What are the payment terms?
A:
We accept LC, T/T, PayPal, and Western Union.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
Supplier replies will be sent to your registered email
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