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Smart Laminating Solutions for Optimizing Semiconductor Manufacturing Process
US$8,000.00-10,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

Online Service

Function

High Temperature Resistance

Model NO.

HM0016

Demoulding

Pull Core

Condition

New

Certification

ISO, CE

Warranty

12 Months

Automatic Grade

Automatic

Installation

Vertical

Driven Type

Manual

Mould Life

300,000-1,000,000 Shots

Type

Manual/Benchtop Laminator

Process

Pre-Cutting/Dicing Surface Protection

Operation

Easy-to-Use, No Training Required

Supported Materials

Wafers (Including Ultra-Thin) Glass Substrates

Film Types

Blue, UV, Pet Backing, Oduble-Layer Tapes

Wafer Size Capacity

6, 8 12 Inch

Transport Package

Air Freight

Specification

customized

Trademark

Himalaya

Origin

China

Production Capacity

200

Key features

Cost-Saving Film Design: Proprietary mechanism minimizes film waste, significantly reducing consumable costs over time.
Gentle Lamination: Air-flexible pressure roller and spring-loaded table protect fragile and ultra-thin substrates.
Easy Operation: Intuitive design allows immediate use with zero training required, streamlining workflow.
Compact Benchtop: Small footprint perfect for cleanrooms and environments where space is limited.
Wide Material Compatibility: Suitable for blue tape, UV tape, PET backing, and double-layer tapes on various substrates.
Heated Adaptive Table: Heated elastic table ensures optimal adhesion and accommodates wafers of different thicknesses.
Integrated Cutting: Equipped with circumferential and transverse knives for quick and clean film cutting.
Anti-Static Option: Optional ionizing bar removes static electricity to prevent dust attraction and improve yield.

Company profile

Jiangsu Himalaya Semiconductor Co., Ltd.
QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.14h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:Is the machine automatic or manual?
A:
The manual film laminator series is designed for manual operation but features automatic substrate handling mechanisms for efficiency.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.
Q:What are the payment terms?
A:
We accept LC, T/T, PayPal, and Western Union.

Send Inquiry

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