Is customization available for this machine?

Yes, we offer flexible customization including OEM, ODM, and design services.

What is the minimum order quantity?

The minimum order quantity is 1 set.

What are the lead times for delivery?

Peak season lead time is 3-6 months, while off-season lead time is 1-3 months.

High-Precision Automatic Die Bonding Machine for Semiconductor Applications

Name: High-Precision Automatic Die Bonding Machine for Semiconductor Applications
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2107708942

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$7,000.00-70,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

Free Training

Condition

New

Model NO.

HMLY-DB-01

Speed

Super High Speed

Precision

High Precision

Certification

RoHS, CE

Warranty

24 Months

Automatic Grade

Automatic

Type

Ultra High-speed Chip Mounter

Product Name

Die Bonding Machine

Item Number

SD800

Suitable with

To263 & To220 & To247 & To3p, etc.

Function

Tinning/Writing/Pressing,Map Function

Track Width

up to 70mm

Wafer Size

20X20-560X560mil, (0.5X0.5-14X14mm)

Solder Thickness

1mil-3mil

Service

Designing,Online Free Training & Warranty Service

Transport Package

Wooden Box by Sea Shipping

Specification

standard package

Trademark

Himalaya

Origin

China

Production Capacity

5000

Key features

Ultra High Speed: Production capacity up to 5,000 units per hour depending on process.

Advanced Oxygen Control: Ultra-low oxygen environment (<50 ppm) ensures high-quality soldering.

Wide Wafer Compatibility: Supports wafer sizes from 20x20 to 560x560 mil (0.5x0.5-14x14mm).

Comprehensive Functions: Supports tinning, writing, pressing, and Map algorithm functions.

Flexible Customization: OEM, ODM, and design services available for tailored solutions.

Smart Tracking System: Track width up to 70mm with 8-stage independent temperature zones.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.50h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.

Q:Why choose us?

OEM/ODM/Designing.

Q:What is the production capacity of the SD800?

The machine can produce 3,000 to 5,000 units per hour, depending on the specific process used.

Q:What types of packages does the machine support?

SD800 is mainly used for single-row lead frame packages such as TO263, TO220, TO247, and TO3P.