Powered by Made-in-China.com
High Precision Die Bonding Machine for Semiconductor Chips
US$100,000.00-1,000,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
ProvidedCondition
NewModel NO.
SHD8120SSpeed
High SpeedPrecision
High PrecisionCertification
ISOWarranty
12 MonthsAutomatic Grade
AutomaticProduct Name
Semiconductor EquipmentFeature 1
Guaranteed QualityFeature 2
Customized According to NeedsAfter-Sale Service
ProvidedTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaKey features
Flexible Customization: Customized according to needs with flexible customization options available.
Comprehensive Warranty: 12 months warranty coverage for all mechanical equipment.
High Speed Production: Ultra-high speed processing with UPH ranging from 4K to 8K.
Wide Compatibility: Supports wafer sizes from 12 inches and chip sizes 0.5x0.5 to 14x14mm.
ISO Certified Quality: Manufactured with ISO certification ensuring high quality standards.
Professional Support: 24 hours online professional technical support provided.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.67h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
You may also like
12inch Fully Automatic Soft Solder Die Bonding Machine Factory for Semiconductor Assembly
US$7,000.00-70,000.00
1 Piece(MOQ)
High-Speed Die Attach Machines for Efficient Chip Assembly
US$40,000.00-100,000.00
1 Piece(MOQ)
Automatic High Precision Die Bonder Die Bonding Machine for COB Box to Tec Mems HDMI
US$140,000.00-220,000.00
1 Piece(MOQ)
Semiconductor Packaging Equipment High Precision Die Bonder Attach Die Bonding Machine
US$30,000.00-60,000.00
1 Piece(MOQ)
High-Precision COB Die Bonding Machine for LED Tubes
Negotiable
1 Piece(MOQ)
Semiconductor IC / to Package Machine Automatic Die Attach Die Bonder Bonding Machine
US$50,000.00-99,999.00
1 Piece(MOQ)
High Speed Precision Automatic Semiconductor Equipment IC Package Wafer Die Bond Die Bonding Attach Eutectic Crystal Planting Machine
US$50,000.00-99,999.00
1 Piece(MOQ)
High-Precision Automatic Die Attach Machine for Efficient IC Packaging
US$7,000.00-70,000.00
1 Piece(MOQ)
Tri Tr7720s Ai-Powered 2D Aoi Machine High Precision Inline Automatic Optical Inspection for Semiconductor & SMT Assembly
US$10,000.00-15,000.00
1 Piece(MOQ)
Used Asm Wire Bonder High Precision Automatic Semiconductor Die & Wire Bonding Machine for SMT Packaging Line
US$25,000.00-39,999.00
1 Piece(MOQ)
Precision Automatic Tube SMD Taping Machine for Small SMD Semiconductors
US$15,000.00-20,000.00
1 Unit(MOQ)
Gkg High-Speed Flexible Sheet/Tape Die Bonding Machine for Semiconductor Assembly
US$32,500.00-58,000.00
1 Piece(MOQ)
Gkg Gd91m6ls Advanced Die Bonding Machine with Visual Alignment for Display Manufacturing
US$32,500.00-38,000.00
1 Piece(MOQ)
High Speed Hanwha Sm481 Used Pick&Place Machine High Precision Chip Mounter for All Kinds of Components
US$5,000.00-8,000.00
1 Set(MOQ)
High Precision SMT Machine SMT Chip Mounter Panasonic Bm123 Pick and Place Machine for PCB Assembly
US$7,352.00-15,384.00
1 Piece(MOQ)
Meraif High Speed Flexible Mounter Hanwha Decan F2 Pick and Place Machine LED SMT SMD Chip Mounter for PCBA Assembly Factory
US$58,000.00-63,000.00
1 Piece(MOQ)
High Quality High Speed SMT FUJI Nxt M3/M3s Chip Mounter SMT FUJI Nxt M3/ M3s Pick and Place Machine for LED PCB Assembly
US$1,500.00-3,000.00
1 Piece(MOQ)
High-Precision Kohyoung Zenith Lite 3D Inline Aoi for SMT Lines PCB Machine
US$125,700.00
1 Piece(MOQ)
