Powered by Made-in-China.com
High Precision Die Bonding Machine for Semiconductor Chips
US$100,000.00-1,000,000.001 Piece
High Precision Die Bonding Machine for Semiconductor Chips
US$100,000.00-1,000,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
ProvidedCondition
NewModel NO.
SHD8120SSpeed
High SpeedPrecision
High PrecisionCertification
ISOWarranty
12 MonthsAutomatic Grade
AutomaticProduct Name
Semiconductor EquipmentFeature 1
Guaranteed QualityFeature 2
Customized According to NeedsAfter-Sale Service
ProvidedTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaKey features
Flexible Customization: Customized according to needs with flexible customization options available.
Comprehensive Warranty: 12 months warranty coverage for all mechanical equipment.
High Speed Production: Ultra-high speed processing with UPH ranging from 4K to 8K.
Wide Compatibility: Supports wafer sizes from 12 inches and chip sizes 0.5x0.5 to 14x14mm.
ISO Certified Quality: Manufactured with ISO certification ensuring high quality standards.
Professional Support: 24 hours online professional technical support provided.
Company profile
QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤0.01h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
0/4000
Supplier replies will be sent to your registered email
You may also like
12inch Fully Automatic Soft Solder Die Bonding Machine Factory for Semiconductor Assembly
US$7,000.00-70,000.00
1 Piece(MOQ)
Semiconductor Refrigeration Thermo Electric Cooler Tec to Die Bonder Bonding Die Attach Machine Die Mounting Equipment
US$50,000.00-100,000.00
1 Piece(MOQ)
Advanced Semiconductor Packaging Multifunctional High Precision Thickness Minimum 50um Ultrathin Die Sorting Die Sorter Machine
US$120,000.00-149,000.00
1 Piece(MOQ)
Used Asm Siplace X4I High-Speed 4-Gantry SMT Chip Mounter, High Precision Pick & Place Machine for PCB & Semiconductor Assembly Line
US$70,000.00-80,000.00
1 Piece(MOQ)
Semiconductor Wafer Packaging Welding Equipment Laser Vision Micro Desktop Automatic Solidification Machine Die Bonder Bonding
US$116,000.00-150,000.00
1 Piece(MOQ)
High Speed Gkg Gd210 Die Bonding Machine for Optoelectronic & Display Module Production
US$22,500.00-48,000.00
1 Piece(MOQ)
Semiconductor Ad832I Die Bonding Machine, High Precision Automatic Die Attach Equipment
US$100,000.00-120,000.00
1 Piece(MOQ)
Semiconductor IC / to Package Machine Automatic Die Attach Die Bonder Bonding Machine
US$50,000.00-99,999.00
1 Piece(MOQ)
Used Asm Siplace D4I High Speed SMT Pick and Place Machine, 4-Gantry High Precision Chip Mounter for Semiconductor Assembly
US$40,000.00-50,000.00
1 Piece(MOQ)
Advanced LED Die Bonding Machine for Precision Chip Manufacturing Equipment
US$100,000.00-1,000,000.00
1 Piece(MOQ)
High-Precision Automatic Die Bonding Machine for Semiconductor Manufacturing
US$100,000.00-1,000,000.00
1 Piece(MOQ)
High Precision SMT Machine SMT Chip Mounter Panasonic Bm123 Pick and Place Machine for PCB Assembly
US$7,352.00-15,384.00
1 Piece(MOQ)
Advanced Precision Die Bonding Machine for Optimal Soldering Solutions
US$7,000.00-70,000.00
1 Piece(MOQ)
SMT Pick and Place Machine with 8 Heads High Precision Best Price Chip Mounter for Production Line
US$2,000.00-10,000.00
1 Set(MOQ)
Precision Automatic Tube SMD Taping Machine for Small SMD Semiconductors
US$15,000.00-20,000.00
1 Unit(MOQ)
High Speed Hanwha Sm481 Used Pick&Place Machine High Precision Chip Mounter for All Kinds of Components
US$5,000.00-8,000.00
1 Set(MOQ)
Hanwha SMT Chip Mounter Machine for High Speed Precision PCB Assembly
US$65,000.00-85,000.00
1 Piece(MOQ)
China Semiconductor Manufacturing High Frequency Cof Wire Bonder Cm Linda Asmpt Automatic Wafer Die Acf Bonding Machine
US$35,000.00-65,000.00
1 Set(MOQ)
China Semiconductor High Frequency Die Cof Manufacturing Equipment Asmpt Ab383 Fully Automatic Acf Wire Wafer Bonding Machine
US$45,000.00-68,000.00
1 Set(MOQ)







