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High-Precision Automatic Die Attach Machine for Efficient IC Packaging
US$7,000.00-70,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
Free TrainingCondition
NewModel NO.
HMLY-DB-003Speed
Super High SpeedPrecision
High PrecisionCertification
RoHS, CEWarranty
24 MonthsAutomatic Grade
AutomaticType
Ultra High-speed Chip MounterProduct Name
Die Bonding MachineItem Number
SD800Suitable with
To263 & To220 & To247 & To3p, etc.Function
Tinning/Writing/Pressing,Map FunctionTrack Width
up to 70mmWafer Size
20X20-560X560mil, (0.5X0.5-14X14mm)Solder Thickness
1mil-3milService
Designing,Online Free Training & Warranty ServiceTransport Package
Wooden Box by Sea ShippingSpecification
standard packageTrademark
HimalayaOrigin
ChinaProduction Capacity
5000Key features
Ultra-High Speed Performance: Achieves 3,000-5,000 UPH with optimized dot/press soldering for lead frames.
Advanced Oxygen Control: Gas-heat track structure design ensures ultra-low oxygen content (<50 ppm).
Comprehensive Warranty: Standard 12-month warranty or 2,000 operating hours, extendable to 36 months.
Global After-Sales Support: 24/7 technical assistance, spare parts supply, and on-site or remote training.
Smart AI Alignment: Features AI-assisted alignment, multi-machine linking, and GSM remote monitoring.
Flexible Customization: Tailored solutions available for unique production needs and specific attachments.
Wide Application Scope: Suitable for IC packaging, power electronics, MEMS, sensors, and RF devices.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.86h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:Do you provide after-sales service overseas?
A:
Yes, we have partnered service centers in key regions.
Q:Can I request a customized size?
A:
Absolutely! We offer tailored attachments.
Q:What documents do you provide for export?
A:
Full export package (Commercial Invoice, Packing List, Bill of Lading, COC, etc.).
Q:How do I place an order?
A:
Contact us via email/phone for a quote, then confirm with a PO.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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