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Next-Gen Laser Debonding System for Wafer Cleaning Solutions
US$100,000.00-1,000,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
1 YearsFunction
Abrasion Resistance, High Temperature ResistanceModel NO.
LDM-01Demoulding
AutomaticCondition
NewCertification
ISOWarranty
12 MonthsAutomatic Grade
AutomaticInstallation
VerticalDriven Type
ElectricMould Life
300,000-1,000,000 ShotsProduct Name
Laser DebondingFeature 1
Stripping and Cleaning FunctionsFeature 2
Real-Time MonitoringOEM/ODM Service
ProvidedTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaKey features
All-in-One Process Integration
Square Top Hat Beam for Superior Thermal Control
Active Process Stabilization
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.50h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:Why is a square top hat beam better than a Gaussian beam for wafer debonding?
A:
A square top hat beam provides uniform energy density across the entire scanned area, avoiding hot spots that can crack ultra-thin wafers. It also maximizes debonding efficiency by matching the typical rectangular scan pattern used in production tools.
Q:What adhesive types are compatible with this system?
A:
The system is designed for use with wavelength-matching temporary bonding adhesives (provided or specified by the supplier). Both 355nm and 1340nm laser options are available to suit different adhesive absorption characteristics.
Q:How long does it take to debond a full 12-inch wafer?
A:
Typical laser scan time is approximately 100 seconds per 12-inch wafer, excluding handling and cleaning steps. This supports high-volume manufacturing with fast cycle times.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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