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Customizable Four-Head Roll-to-Roll Laser Drilling Equipment for HDI PCB/FPC
US$340,000.00
1-4 Pieces
US$330,000.00
5-9 Pieces
US$315,000.00
10+ Pieces
Sample price:US$0.00/piece.Request sample

Product profile

Customization

Available

After-sales Service

12 Months

Warranty

12 Months

OEM&ODM

Accepted

Certificate

ISO9001, CE, RoHS

Sample

Available

Number of Laser Heads

4 Heads (Synchronous/Independent)

Application

HDI PCB, FPC, IC Substrate, Ceramic

Processing Materials

Copper Clad Laminate, Fr4, Polyimide, Glass Epoxy

Laser Type

Nanosecond UV, Picosecond UV, Picosecond Green Las

Key Innovation

Industry-First 4-Head Synchronous Technology

Efficiency Boost

300% Higher Output Than Single-Head

Market Positioning

High-End Electronics Manufacturing

Transport Package

Wooden Case

Specification

7200mm×2300mm×2250mm

Trademark

INTE

Origin

China

Production Capacity

100sets/Month

Key features

300% Efficiency Boost: Delivers 4x higher output than single-head systems to meet tight deadlines.
Plasma-Free Process: Fine-tuned laser parameters eliminate post-drilling plasma treatment needs.
Superior Hole Quality: Produces burr-free, crack-free holes with no thermal damage on delicate materials.
Multi-Mode Flexibility: Supports roll-to-roll, roll-to-sheet, and sheet-to-sheet automation.
Versatile Material Processing: Handles HDI PCB, FPC, IC substrates, ceramics, and copper clad laminates.
Comprehensive After-Sales: Includes 12-month warranty, training, installation, and 24/7 spare parts support.

Company profile

Shenzhen Inte Laser Technology Co., Ltd.
Importers and ExportersCooperated with Fortune 500Self-brandedExhibition Experience
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 4 years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤7.25h

AI-Powered supplier vetting

SummaryThe supplier is a limited company with 182 employees and offers laser-processing equipment, including automatic laser cutting, drilling, wafer marking, glass cutting, and laser marking machines. Its R&D capability is supported by available design documentation, 3D design services, recent new-product development, ODM/OEM services, and SDK availability. The supplier provides flexible customization and has documented procedures for finished-product inspection, supplier management, corrective actions, and complaint handling. After-sales services include debugging, maintenance, repair, training, and equipment installation in the USA, Canada, and Macedonia. However, no overseas warehouses, showrooms, agents, or branches are reported. The provided information does not establish certifications, financial credibility, or identifiable customer cases.
Supplier typeThe supplier is identified as a combined company and a limited company, with 182 employees and no stated affiliation with a larger corporate group. Its product scope is centered on laser-processing equipment.
After-Sales capabilityThe supplier’s engineers support production and after-sales service, while overseas offerings include debugging, maintenance, repair, training, and equipment installation in the USA, Canada, and Macedonia. Complaint handling has a clear procedure with followed records, although the supplier reports no overseas warehouse, showroom, agent, or branch.
R&D capabilityThe supplier reports available R&D audit documentation, including design input, output, review, verification, and validation records; it also provides 3D design services, had new products during the past year, and offers ODM, OEM, and SDK capabilities. These are explicit indicators of established product-development capability.
Production capacityThe supplier offers multiple laser equipment products, has 182 employees, uses documented and uniformly followed finished-product inspection instructions, and maintains procedures for supplier qualification, service capability, corrective actions, quality assurance, complaint handling, and material traceability. The slices support structured production and quality processes, but do not provide production capacity or output figures.
Customization capabilityThe supplier explicitly provides 3D software design services and supports customization from samples, customization from designs, full customization, minor customization, and flexible customization. This directly demonstrates broad customization coverage.

Product Q&A

Q:Does it support blind vias and buried vias?
A:
Yes, it handles blind via drilling (BVB), buried vias, and through-holes with minimal Heat Affected Zone (HAZ) for clean sidewalls.
Q:Is it automated?
A:
Yes, it features CCD Vision Alignment and automated loading with real-time distortion correction for flexible boards.
Q:Is beam quality consistent across all heads?
A:
Our beam splitting technology ensures uniform energy distribution across all 4 heads, guaranteeing consistent hole quality.
Q:What after-sales support is provided?
A:
Includes comprehensive warranty, online technical training, installation assistance, and spare parts for 24/7 continuous operation.

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