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Wedge Bonder Semiconductor Wire Bonding Device Semiconductor Aluminum Wire Welding Machine
Negotiable
1 Piece
Product profile
Customization
AvailableAfter-sales Service
Free TrainingCondition
NewSpeed
Super High SpeedPrecision
High PrecisionCertification
RoHS, CEWarranty
24 MonthsAutomatic Grade
AutomaticType
Ultra High-speed Chip MounterProduct Name
Wedge Bonder DeviceFeature
Graphical Editor,Multi-Segment BondingItem Number
as-EVTransport Package
Wooden Box by Sea ShippingSpecification
standard packageTrademark
HimalayaOrigin
ChinaProduction Capacity
5000Key features
High Precision Bonding: Features high precision and super high speed for reliable semiconductor wire bonding.
Advanced Pattern Recognition: Includes new powerful pattern recognition capabilities for improved bonding quality.
Direct Drive Motion System: Precise direct drive motion system ensures high repeatability with minimal maintenance.
Graphical Editor Support: Equipped with graphical editors and multi-segment bonding for easy programming.
Expanded Bondable Area: Enhanced flexibility and reduced line integration costs due to expanded bonding area.
Flexible Customization: Offers flexible customization options including OEM, ODM, and design services.
RoHS and CE Certified: Complies with RoHS and CE certification standards for safety and quality.
100% Product Inspection: All finished products undergo 100% visual and function inspection before shipping.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.15h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:Why choose us?
A:
OEM/ODM/Designing.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 Set.
Q:What are the payment terms?
A:
We accept LC, T/T, PayPal, and Western Union.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
Supplier replies will be sent to your registered email
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