Powered by Made-in-China.com
Heavy Wire Bonder Wire Bonding Machine for to Package
US$140,000.00-220,000.00
1 Piece
Sample price:US$100.00/piece.Request sample
Product profile
Customization
AvailableAfter-sales Service
1 YearCondition
NewModel NO.
MDAWB-LS702SSpeed
High SpeedPrecision
PrecisionCertification
CEWarranty
12 MonthsAutomatic Grade
AutomaticType
High-speed Chip MounterTrademark
minder-hightechOrigin
ChinaKey features
High Production Efficiency: Double bonding head design enables faster throughput for TO package applications.
Precision Bonding Control: Stable bonding force control and real-time detection ensure high quality and reliability.
Programmable Ultrasonic Power: Adjustable ultrasonic power settings at different stages optimize bonding performance.
Real-time Quality Monitoring: On-line tension and bond line length detection guarantee product consistency.
High Resolution Feedback: Motorized wire feed system with high resolution encoder for precise control.
Wide Wire Compatibility: Supports wire sizes from 5mil to 20mil and ribbon wires up to 80*10mil.
Flexible Loop Height: Programmable maximum and minimum loop height settings for various requirements.
1-Year Warranty Coverage: Comprehensive 12-month warranty included with new condition equipment.
Company profile

Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤8.62h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW
About Our Factory & Business Background
AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2014-12-30
Main MarketsNorth America, Europe
Overseas Agent/BranchNo
Product Q&A
Q:What is the maximum production speed?
A:
The machine offers a throughput of 3.6K UPH (Units Per Hour) for high-speed operations.
Q:What wire sizes does the machine support?
A:
It supports wire sizes from 5mil to 20mil (125um~500um) and ribbon wires from 20*4 mil to 80*10mil.
Q:What is the warranty period?
A:
The machine comes with a 12-month warranty covering mechanical defects.
Q:What are the dimensions of the machine?
A:
The dimensions are 1070mm (Width) x 1800mm (Length) x 1760mm (Height) with a weight of 1300kg.
Q:What is the lead time for delivery?
A:
The average lead time is one month, applicable for both peak and off-peak seasons.
Send Inquiry
*To:
Guangzhou Minder-Hightech co.,Ltd
Guangzhou Minder-Hightech co.,Ltd*Content:
Supplier replies will be sent to your registered email
You may also like
Asm PT Aerocam Series Wire Bonder, High-Speed Automatic Wire Bonding Machine for IC & LED Packaging
US$23,000.00-40,000.00
1 Piece(MOQ)
K&S Maxum Plus Automatic Gold Ball Wire Bonder, High-Speed Semiconductor Bonding Machine for IC & LED Packaging
US$23,000.00-40,000.00
1 Piece(MOQ)
Semiconductor IC / to Package Machine Automatic Die Attach Die Bonder Bonding Machine
US$50,000.00-99,999.00
1 Piece(MOQ)
Used Asm Wire Bonder, High Precision Automatic Die & Wire Bonding Machine for Semiconductor Packaging Line
US$25,000.00-39,999.00
1 Piece(MOQ)
Automatic High Precision Die Bonder Die Bonding Machine for COB Box to Tec Mems HDMI
US$140,000.00-220,000.00
1 Piece(MOQ)
Used Asm Wire Bonder High Precision Automatic Semiconductor Die & Wire Bonding Machine for SMT Packaging Line
US$25,000.00-39,999.00
1 Piece(MOQ)
High-Speed Wire Bonding Machine for Production Line
US$7,000.00-70,000.00
1 Piece(MOQ)
Advanced Precision Wire Bonding Machines for Semiconductor Production
US$7,000.00-70,000.00
1 Piece(MOQ)
T O Automatic Ultrasonic Aluminum Wire Welding Press Wire Bonder Bonding Machine
US$45,000.00-65,000.00
1 Piece(MOQ)
Universal Thermal Bonding Machine for to-220, to-247, to-252, to-263 Devices
US$7,000.00-70,000.00
1 Piece(MOQ)
Advanced Packaging Manual Semi-Auto Ultrasonic Gold Ball Wedge Wire Bonder Bonding Machine
US$51,000.00-80,000.00
1 Piece(MOQ)
Ky Inline SMT 3D Aoi Wire Bonding Aoi Inspection System in SMT Machine
US$125,700.00
1 Piece(MOQ)
Reliable FUJI SMT Placement Machine for PCB Production Low Failure Rate Ready to Ship
US$85,000.00-95,000.00
1 Piece(MOQ)
Kohyong 3D Inline Aoi Solution for Efficient SMT Production Acf Bonding Machine
US$105,600.00
1 Piece(MOQ)
High Quality Samsung Hanwha Sm431 for PCB Assembly Line SMT Samsung Sm431 Chip Mounter Samsung Sm431 Pick and Place Machine
US$15,000.00-31,700.00
1 Piece(MOQ)
Ultra High Speed Chip Mounter GDK Yrm10 SMT Pick and Place Machine for PCB Assembly Electronics Manufacturing
US$8,000.00-10,000.00
1 Set(MOQ)













