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Semiconductor Wafer Edge Rounding Machine for IC Industry
US$7,000.00
1 Piece

Product profile

Customization

Available

Warranty

1 Year

Application

Silicon Wafers

Model NO.

BW

Voltage

380 V

Core Components

PLC

Machinery Test Report

Provided

Key Selling Points

Automatic

Video Outgoing-Inspection

Provided

Power (Kw)

2

Weight (Kg)

350

Grinding Disc Size

4 Inches

Workpiece Size

3-6 Inches

Grinding Wheel Speed

0-4500rpm Adjustable

Wafer Center Positioning Accuracy

≤±0.1mm

Grinding Speed

1mm/S-50mm/S

Adhesion Force

Better Than -80kpa

Main Motor Speed

0-90rpm

Transport Package

1560X700X940mm

Trademark

BW

Origin

Jiangsu, China

Key features

Wide Size Compatibility: Processes silicon wafers ranging from 3 to 6 inches with adjustable grinding speeds.
Automatic Operation: Semi-automatic design requires only manual loading/unloading while automating the grinding process.
Adjustable Parameters: Features 0-4500rpm grinding wheel speed and 1-50mm/s grinding speed for flexible processing.
Strong Vacuum Adhesion: Equipped with vacuum chuck providing adhesion force better than -80kpa for secure wafer fixing.
OEM/ODM Support: Offers full customization, minor customization, and flexible customization options for clients.
Core Component Quality: Utilizes reliable PLC core components with provided machinery test reports for quality assurance.
Compact & Efficient: Small footprint of 30 sqm with 2KW power consumption and 350kg weight for easy integration.

Company profile

Nanjing Likesmile New Energy Technology Co., Ltd.
High Repeat Buyers ChoiceFast DeliveryMinor CustomizationR&D Capabilities
CertifiedBusiness Type: Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 1 Year CertifiedNearest Port: Shanghai PortAverage Response Time: ≤6.03h

About Our Factory & Business Background

AddressRoom 590, No. 80, Xiaoshi Street, Gulou District, Nanjing, Jiangsu, China
Plant Area30 square meters
Number of Employees4
Registered Capital1,000,000 RMB
Terms of PaymentLC
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Minimum Order Quantity1 Set
Supply Chain Partners20

Our Production Capability & Technical Expertise

Main ProductsMechanical Equipment
R&D Engineers1 people

Our Industry Experience & Global Business Record

Year of Establishment2023-02-27
Main MarketsAustralia
Repeat Buyers Choice50%~80%
Number of Foreign Trading Staff1
Overseas Agent/BranchNo
New Products Launched in Last yearNo

Our Certifications, Standards & Industry Recognition

Cooperated with Fortune 500No

Product Q&A

Q:What is the warranty period for this machine?
A:
The equipment comes with a 1-year warranty.
Q:What sizes of silicon wafers can this machine process?
A:
It is designed to process various wafer sizes, specifically accommodating 3 to 6-inch wafers.
Q:Is customization available for this equipment?
A:
Yes, we offer full customization, minor customization, and flexible customization from samples or designs.
Q:What is the minimum order quantity (MOQ)?
A:
The minimum order quantity is 1 set.
Q:What are the payment terms?
A:
The accepted payment term is LC (Letter of Credit).

Send Inquiry

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