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Semiconductor Wafer Grinding Machine for Ultra Thin Wafer
US$7,000.00
1 Piece
US$6,500.00
2+ Pieces
Product profile
Customization
AvailableWarranty
1 YearMaterial
CopperModel NO.
BWCore Components
PLCMachinery Test Report
ProvidedVideo Outgoing-Inspection
ProvidedPower (Kw)
1.5Weight (Kg)
600Machining Accuracy
High PrecisionGrinding Wheel Speed
60 (Rpm)Maximum Grinding Size
110 (mm)Control Method
CNCTransport Package
700*950*1950mmTrademark
BWOrigin
Jiangsu, ChinaCompany profile
CertifiedBusiness Type: Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 1 Year CertifiedNearest Port: Shanghai PortAverage Response Time: ≤6.25h
About Our Factory & Business Background
AddressRoom 590, No. 80, Xiaoshi Street, Gulou District, Nanjing, Jiangsu, China
Plant Area30 square meters
Number of Employees4
Registered Capital1,000,000 RMB
Terms of PaymentLC
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Minimum Order Quantity1 Set
Supply Chain Partners20
Our Production Capability & Technical Expertise
Main ProductsMechanical Equipment
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2023-02-27
Main MarketsAustralia
Repeat Buyers Choice50%~80%
Number of Foreign Trading Staff1
Overseas Agent/BranchNo
New Products Launched in Last yearNo
Our Certifications, Standards & Industry Recognition
Cooperated with Fortune 500No
Send Inquiry
*To:
Nanjing Likesmile New Energy Technology Co., Ltd.
Nanjing Likesmile New Energy Technology Co., Ltd.*Content:
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