Powered by Made-in-China.com
Semiconductor Packaging Equipment High Precision Die Bonder Attach Die Bonding Machine
US$30,000.00-60,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
ProvideCondition
NewModel NO.
MD-JC360 MD-JC380 MD-JC360-D MD-JC380-DSpeed
High SpeedPrecision
High PrecisionCertification
CEWarranty
12 MonthsAutomatic Grade
AutomaticType
Ultra High-speed Chip MounterTransport Package
Wooden CrateSpecification
500KGTrademark
minder-hightechOrigin
GuangzhouHS Code
8015809090Production Capacity
200PCS/Yearpcs/YearKey features
Customizable Solutions: All equipment needs to be customized according to your samples.
High Production Capacity: Production capacity is greater than 12k with cycle time less than 250ms.
CE Certified Quality: Equipment meets CE certification standards for safety and quality.
12-Month Warranty: Comprehensive 12-month warranty with cost-price replacement after.
Professional Support: Engineers available for installation, debugging, and maintenance services.
Company profile
Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤7.89h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW
About Our Factory & Business Background
AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2014-12-30
Main MarketsNorth America, Europe
Overseas Agent/BranchNo
Product Q&A
Q:How is the pricing determined?
A:
Prices are competitive and negotiable, varying based on configuration and customization complexity.
Q:Do you offer sample production services?
A:
Yes, we provide sample production services, though some fees may apply.
Q:What are the payment terms?
A:
A deposit is required after plan confirmation. The balance is paid after equipment readiness, followed by shipment.
Q:How is delivery and inspection handled?
A:
An acceptance video is sent upon completion. You can also visit the site to inspect the equipment before shipping.
Q:Is installation and debugging included?
A:
Engineers can be dispatched for installation and debugging. A separate quotation applies for this service fee.
Send Inquiry
*To:Guangzhou Minder-Hightech co.,Ltd
Guangzhou Minder-Hightech co.,Ltd*Content:
Supplier replies will be sent to your registered email
You may also like
Semiconductor Packaging Ad832I Fully Automatic Die Bonding Machine
US$100,000.00-120,000.00
1 Piece(MOQ)
High Precision Die Bonding Machine for Semiconductor Chips
US$100,000.00-1,000,000.00
1 Piece(MOQ)
Semiconductor Refrigeration Thermo Electric Cooler Tec to Die Bonder Bonding Die Attach Machine Die Mounting Equipment
US$50,000.00-100,000.00
1 Piece(MOQ)
Used Asm Wire Bonder, High Precision Automatic Die & Wire Bonding Machine for Semiconductor Packaging Line
US$25,000.00-39,999.00
1 Piece(MOQ)
Laser Packaging Equipment Integrated Circuit Microwaveball Welding Wedge Welding Machine Gold Wire Bonding Wire Bonder
US$2,000.00-5,000.00
1 Piece(MOQ)
Precision Automatic Eutectic Flip Chip Die Bonding Machine for IC Packaging
US$7,000.00-70,000.00
1 Piece(MOQ)
High Precision Semiconductor Equipment Die Bonding Machine Fully Automatic
US$50,000.00-100,000.00
1 Piece(MOQ)
High Precision Wafer Bonding Machine Die Bonder Eutectic Crystal Planting Machine
US$9,999.00-999,999.00
1 Piece(MOQ)
Advanced Semiconductor Packaging Multifunctional High Precision Thickness Minimum 50um Ultrathin Die Sorting Die Sorter Machine
US$120,000.00-149,000.00
1 Piece(MOQ)
High-Precision Automatic Die Bonding Machine for Semiconductor Manufacturing
US$100,000.00-1,000,000.00
1 Piece(MOQ)
Asm Ad832I Fully Automatic Die Bonder, High Speed Semiconductor Packaging Machine
US$100,000.00-120,000.00
1 Piece(MOQ)
Fully Automatic Juki Semiconductor Equipment Acf Chip Machine
US$82,500.00
1 Piece(MOQ)
KOH Young 3D High Precision SMT Machine PCB Testing Equipment Online Aoi Machine
US$85,000.00
1 Piece(MOQ)
High Precision Panasonic Npm-D3 SMT Pick and Place Machine Production Line Equipment
US$5,000.00-8,000.00
1 Set(MOQ)
Electronic Products Machinery Automatic UV Conformal Coating Equipment for PCBA High Precision Coating Line Equipment
US$18,000.00-20,000.00
1 Piece(MOQ)
