Powered by Made-in-China.com
Advanced Die Attach Machine for Versatile Packaging Solutions
US$70,000.00-100,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
ProvidedCondition
NewModel NO.
SHM8120(120T)Speed
High SpeedPrecision
High PrecisionCertification
ISO, CEWarranty
12 MonthsAutomatic Grade
AutomaticType
High-speed Chip MounterProduct Name
Semiconductor EquipmentFeature 1
Guaranteed QualityFeature 2
Customized According to NeedsAfter-Sale Service
ProvidedUph
15,000 to 20,000Placement Accuracy
+/-10 UmDie Size Capability
0.2*0.2mm to 25*25mmDispensing Pattern
Dots, Lines, Crosses, or SnowflakesHybrid Bonding
Ultra-Thin 3D Stacked ChipsTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaCompany profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.86h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
You may also like
High-Precision Automatic Die Attach Machine for Efficient IC Packaging
US$7,000.00-70,000.00
1 Piece(MOQ)
Advanced Precision Die Bonding Machine for Optimal Soldering Solutions
US$7,000.00-70,000.00
1 Piece(MOQ)
Advanced Semiconductor Packaging Equipment Accuracy 1um Gantry Multi Needle Nozzle Replacement Die Sorter Die Sorting Attach Machine
US$170,000.00-190,000.00
1 Set(MOQ)
Advanced Die Bonding Machine for Diodes and Transistors
US$7,000.00-70,000.00
1 Piece(MOQ)
Automatic Dispensing Die Attach Die Bonder Machine for Hic Mcm Microwave Optoelectronics
US$90,000.00-200,000.00
1 Piece(MOQ)
Advanced Semiconductor Packaging Multifunctional High Precision Thickness Minimum 50um Ultrathin Die Sorting Die Sorter Machine
US$120,000.00-149,000.00
1 Piece(MOQ)
Used Asm Wire Bonder High Precision Automatic Semiconductor Die & Wire Bonding Machine for SMT Packaging Line
US$25,000.00-39,999.00
1 Piece(MOQ)
Gkg Gd91m6ls Advanced Die Bonding Machine with Visual Alignment for Display Manufacturing
US$32,500.00-38,000.00
1 Piece(MOQ)
Advanced Juki SMT Assembly Machine for Smart Factory Solutions
US$85,000.00-95,000.00
1 Piece(MOQ)
Tri Tr7900q Sii 3D Semi Aoi Machine 2.5μm High Resolution Inline Automatic Optical Inspection for Semiconductor Advanced Packaging
US$16,000.00-21,000.00
1 Piece(MOQ)
Semiconductor Packaging Equipment High Precision Die Bonder Attach Die Bonding Machine
US$30,000.00-60,000.00
1 Piece(MOQ)
Used Asm Wire Bonder, High Precision Automatic Die & Wire Bonding Machine for Semiconductor Packaging Line
US$25,000.00-39,999.00
1 Piece(MOQ)
Advanced 3D Spi Solution for SMT Inspection Machines
US$70,000.00
1 Piece(MOQ)
Precision Automatic Eutectic Flip Chip Die Bonding Machine for IC Packaging
US$7,000.00-70,000.00
1 Piece(MOQ)
Advanced PCBA Automated Optical Inspection Machine Ky 8030-3 for SMT 3D Spi
US$85,000.00
1 Piece(MOQ)
Besi Datacon 8800 FC Quantum Advanced Die Bonding Machine
US$320,000.00-350,000.00
1 Piece(MOQ)
Panasonic Npm-D3a SMT Placement Machine Advanced Technology for High-Efficiency PCB Assembly
US$5,000.00-8,000.00
1 Set(MOQ)
1packing Machine for Bulk and Retail Packaging Machine
US$1.00
1 Piece(MOQ)
Besi Datacon 2200 Evo Advanced Supplier Die Bonder Manufacture Die Bonding Machine
US$19,999.00-69,999.00
1 Piece(MOQ)