Powered by Made-in-China.com
Desktop Laboratory Gantry High-Precision Small Multifunctional Automatic Die Attach Die Mounter Automatic Eutectic Patch Chip Bonder
US$116,000.00-150,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
1 YearCondition
NewModel NO.
MDSpeed
High SpeedPrecision
High PrecisionCertification
CEWarranty
12 MonthsAutomatic Grade
AutomaticType
High-speed Chip MounterTransport Package
Wooden CaseTrademark
minder-hightechOrigin
ChinaProduction Capacity
1000Key features
Force-Controlled Soft Landing: Prevents chip damage with precise force control ranging from 10g to 80g.
AI Flatness Calibration: Reduces voids in die bonding through automated flatness calibration.
Fast Needle Calibration: Auto calibration completed in less than 3 minutes with automatic tip change.
Flexible Dispensing Control: Adjustable pressure-time mode with free parameter settings for height and speed.
Modular Design: Easy integration with other modules for various configurations and applications.
High Production Efficiency: Processes not less than 180 components per hour for 0.5mm x 0.5mm chips.
Company profile

Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤15h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW
About Our Factory & Business Background
AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2014-12-30
Main MarketsNorth America, Europe
Overseas Agent/BranchNo
Product Q&A
Q:Are your prices negotiable?
A:
All prices are competitive and negotiable, varying based on configuration and customization complexity.
Q:Do you offer sample production services?
A:
Yes, we can provide sample production services, though some fees may apply.
Q:What is the payment process?
A:
After plan confirmation, a deposit is required. The balance is paid after the equipment is ready, followed by shipping.
Q:How is delivery handled?
A:
After manufacturing, an acceptance video is sent, and you may also inspect the equipment at the site.
Q:Do you provide installation and debugging services?
A:
Yes, engineers can be dispatched to your factory for installation and debugging upon arrival, with a separate quotation for this service.
Send Inquiry
*To:
Guangzhou Minder-Hightech co.,Ltd
Guangzhou Minder-Hightech co.,Ltd*Content:
Supplier replies will be sent to your registered email
You may also like
Semicon Equipment Advanced Packaging Line Desktop High Precision Multifunction Dispensing Dispenser and Die Attach Chip Bonder
US$116,000.00-150,000.00
1 Piece(MOQ)
Laboratory Micro-Component Photodiode Chip Attachment Submicron Multifunctional Die Bonder
US$99,999.00-999,999.00
1 Piece(MOQ)
Desktop Die Bonder High-Precision Manual-Semi-Automatic dB100
US$90,500.00-119,000.00
1 Piece(MOQ)
Advanced High-Precision Die Attach Bonder for Semiconductor Manufacturing
US$100,000.00-1,000,000.00
1 Piece(MOQ)
Small Semiconductor Die Bonding System for Wafer Die Attach Eutectic Bonder
US$100,000.00-1,000,000.00
1 Piece(MOQ)
Desktop High Precision Semi-Automatic Die Bonder Crystal Bondering Machine Db100
US$90,500.00-119,000.00
1 Piece(MOQ)
Semiconductor High Precision Asmpt Siplace Ca2 Plus Die Bonding and Flip Chip Placement Bonder
US$100,000.00-1,000,000.00
1 Set(MOQ)
Small Automatic Desktop Heavy Wire Bonder Wire Bonding Machine
US$7,000.00-30,000.00
1 Piece(MOQ)
Semi Automatic Flip Chip Die Bonder Semiautomatic with High Precision Termway
US$90,500.00-119,000.00
1 Piece(MOQ)
High-Speed Automatic Epoxy Die Bonder for Precision Manufacturing
US$7,000.00-70,000.00
1 Piece(MOQ)
High Precision Automatic Die Bonder for COB Technology Solutions
US$100,000.00-1,000,000.00
1 Piece(MOQ)
Small Semiconductor Die Bonding System, Wafer Die Attach Eutectic Bonder dB100
US$90,500.00-119,000.00
1 Piece(MOQ)
0.5um Ultra-High-Precision Micro-Assembly Sub-Micron Submicron Die Bonder Epoxy Die Attach
US$99,999.00-999,999.00
1 Piece(MOQ)
High Precision Asm Die Bonder Ad819 Dispensing Equipment for Semiconductor Packaging Solutions
US$10,000.00-1,000,000.00
1 Set(MOQ)
Right M90-L Fully Automatic Die Bonder High Precision LED PCB Chip Mounting Machine
US$22,500.00-38,000.00
1 Piece(MOQ)
China Used Besi Datacon 8800 FC Quantum Advx Manufactures Automatic Ball Wire Flip Chip Wedge Die Bonder
US$158,000.00-259,500.00
1 Piece(MOQ)
Used Combines Speed Precision Stability Automatic Semiconductor Equipment Asm Die Bonding Machine Ad8312 K&S Wedge Wire Bonder
US$29,000.00-58,800.00
1 Piece(MOQ)
Gkg High-Speed Flexible Tape Die Bonder with Precision Dispensing & Auto Film Expanding
US$12,500.00-38,000.00
1 Piece(MOQ)
Asm Semiconductor Equipment Manufacturers Cm Linda Automatic Bonding Machine Supplier Die Bonder
US$100,000.00-1,000,000.00
1 Set(MOQ)
KOH Young 8030 Nova 3D Spi Inspection Quantum Machine Manufacture Die Bonder
US$70,000.00
1 Piece(MOQ)











