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Small-Batch Laboratory Research Automatic Wire Wedge Bonder Wedge Bonding Device
US$7,000.00-30,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
1 YearCondition
NewModel NO.
MDZW-MWB150-WSpeed
High SpeedPrecision
High PrecisionCertification
CEWarranty
12 MonthsAutomatic Grade
AutomaticType
High-speed Chip MounterTransport Package
Wooden CrateTrademark
minder-hightechOrigin
ChinaKey features
Customizable Travel Area: Bonding travel is 200x200mm but can be customized up to 250x300mm for specific needs.
Advanced Visual System: Features AutoPad positioning, Auto Focus, and real-time CCD observation for precise alignment.
Seamless Automation: Backward compatible with semi-auto models and forward compatible with full-auto systems.
Real-Time Monitoring: Includes real-time QC waveform monitoring and dual-camera live-view for process visualization.
Stable High-Speed Performance: High-speed direct-drive platform design ensures stability, precision, and low maintenance.
User-Friendly Interface: Graphical global and unit-specific live-view interfaces guide programming and operation.
Company profile
Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤4.46h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW
About Our Factory & Business Background
AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2014-12-30
Main MarketsNorth America, Europe
Overseas Agent/BranchNo
Product Q&A
Q:What is the warranty period for the equipment?
A:
The equipment comes with a 12-month warranty period. After the warranty expires, we only charge the cost price for any replacement parts.
Q:Can the bonding travel area be customized?
A:
Yes, the standard bonding travel is 200 x 200 mm, but it can be customized up to 250 x 300 mm.
Q:Is sample production service available?
A:
Yes, we provide sample production services, though some fees may apply.
Q:How is the payment structured?
A:
A deposit is required after plan confirmation. The factory prepares the goods, and the balance is paid before shipping once the equipment is ready.
Q:Do you provide installation and debugging services?
A:
Yes, we can dispatch engineers to install and debug the equipment at your factory. A separate quotation applies for this service fee.
Send Inquiry
*To:Guangzhou Minder-Hightech co.,Ltd
Guangzhou Minder-Hightech co.,Ltd*Content:
Supplier replies will be sent to your registered email
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