Does the machine support multi-chip cutting?

Yes, it features a multi-chip cutting function that registers positions for multiple square processed objects to realize alignment and cutting.

Semiconductor Device Fabrication Wafer Fab Beol Feol Dicing Saw Machine for Wafer Cutting High Percision CE

Name: Semiconductor Device Fabrication Wafer Fab Beol Feol Dicing Saw Machine for Wafer Cutting High Percision CE
Brand: Guangzhou Minder-Hightech co.,Ltd
SKU: 1946346455

Guangdong, ChinaGuangzhou Minder-Hightech co.,Ltd

US$47,000.00-63,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

1 Year

Warranty

1 Year

Transport Package

Wooden Crate

Specification

665mm*850mm*1650mm

Trademark

minder-hightech

Origin

Guangzhou

HS Code

8015809090

Production Capacity

200PCS/Yearpcs/Year

Key features

High Precision Dicing: Full positioning accuracy <=0.005mm/210mm with 0.0005mm stroke resolution.

Wide Material Compatibility: Cuts silicon wafers, sapphire, ceramics, PCB, glass, and gallium arsenide.

Advanced Control System: 15-inch LCD touch screen with DS-300 software for easy alignment and operation.

Multi-Chip Cutting: Registers multiple objects for simultaneous alignment and cutting of square processed items.

Customizable Groove Depth: Groove depth <=4mm or customized to meet specific processing requirements.

High-Speed Spindle: 1.5KW high-speed spindle with rotation range of 10000~50000rpm for efficient cutting.

Comprehensive Safety Features: Includes blade database management, auto-focus, and multiple safety alarm functions.

Stable Performance: Low maintenance cost with high reliability and reasonable frame design.

Company profile

Guangzhou Minder-Hightech co.,Ltd

Guangdong, China

Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤6.03h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW

About Our Factory & Business Background

AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China

Registered Capital1,000,000 RMB

Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month

Our Production Capability & Technical Expertise

Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder

R&D Engineers1 people

Our Industry Experience & Global Business Record

Year of Establishment2014-12-30

Main MarketsNorth America, Europe

Overseas Agent/BranchNo

Product Q&A

Q:What is the warranty period for the machine?

We provide a 1-year warranty for the machine, including after-sales service.

Q:What materials can this dicing machine cut?

It supports precision cutting of blue glass, silicon wafers, gallium arsenide, lithium niobate, alumina, ceramics, quartz, sapphire, crystal, and PCB boards.

Q:Is the groove depth customizable?

Yes, the groove depth is <=4mm or can be customized according to your needs.

Q:What is the lead time for delivery?

The average lead time is one month for both peak season and off-season.

Q:What payment terms are accepted?

We accept T/T (Telegraphic Transfer) as the term of payment.