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5.5kg Micro ATX Strong Hardware Acrylic Side Panel Front 3 Fan Computer Case
US$13.00
500-9,999 Boxes
US$12.20
10,000-19,999 Boxes
US$11.00
20,000-49,999 Boxes
US$10.90
50,000+ Boxes
Sample price:US$16.00/piece.Request sample
Product profile
Customization
AvailableCompatible Mainboard
MicroATXPower Supply
Without Power SupplyCase Structure
MATXType
TowerMaterial
0.6mm Main StructureColor
BlackFront Interface
USB3.0+USB2.0+HD AduioCable Management
Back Cable ManagementMaximum Lenght of Graphics Card
350Sheet Thickness
0.6mmFan
Front:12*3/14cm*2Name
Gaming Lux S Glass Computer Case 2021Transport Package
CantonSpecification
360*205*405mmTrademark
SEGOTEPOrigin
ChinaProduction Capacity
1000000Key features
Full Tempered Glass Panel: Features a giant screen full transparent glass side panel for a dream streamer aesthetic.
Advanced Cooling Support: Supports front 280mm and top 240mm water coolers with 3 front and 2 top fan mounts.
Spacious Interior Design: Accommodates graphics cards up to 350mm and CPU coolers up to 160mm height.
Efficient Cable Management: Provides 20mm back-side cable management space for tidy internal wiring.
Dust Protection Features: Includes magnetic dust-proof nets on the top and bottom PSU area for easy cleaning.
OEM/ODM Customization: Offers full customization options including samples, designs, and minor adjustments.
Robust Build Quality: Constructed with 0.6mm SPCC steel main structure and black solid hardware.
Comprehensive Connectivity: Equipped with USB 3.0, two USB 2.0 ports, and HD Audio front interface.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: >24h
AI-Powered supplier vetting
SummaryThe supplier is identified as a manufacturing factory located in Boluo County, Huizhou, China, with combined company characteristics. It demonstrates documented R&D processes, recent new-product development, 3D software design, ODM/OEM services, SDK availability, and broad customization capabilities. Production-related evidence includes automated inspection, screwing, wave soldering, burn-in testing, packaging, and documented finished-product inspection procedures. Quality systems include traceability for raw materials, quality assurance, complaint-handling procedures, and corrective/preventive action records. The supplier has participated in several offline trade shows and offers stated service quotation and payment terms, but no overseas warehouses, showrooms, agents, or branches. Certification holdings, financial credibility, and specific customer cases are not sufficiently documented in the provided information.
Supplier typeThe supplier is described as a factory in the manufacturing industry, located in Boluo County, Huizhou, and classified as a combined company. This supports a direct manufacturing-supplier profile rather than an offshore company.
After-Sales capabilityTechnology engineers are responsible for technical support during production and after-sales service. The supplier also reports documented complaint-handling procedures and records, as well as corrective and preventive action procedures with records, indicating an established support and remediation process.
R&D capabilityThe supplier reports new-product development during the past year, dedicated engineering responsibilities, auditable R&D design-input/output, review, verification, and validation documentation, plus ODM capability and SDK availability. These findings provide explicit evidence of structured product-development and technical innovation capability.
Production capacityProduction evidence includes AOI, automated inspection, automatic screwing, burn-in testing, wave soldering, and heat-shrink packaging facilities. Finished-product inspection instructions are uniformly followed, while supplier-service procedures, approved-supplier controls, quality assurance, raw-material traceability, and stated lead times further support operational capability.
Customization capabilityThe supplier explicitly provides 3D software design and supports customization from samples, designs, full customization, minor customization, and flexible customization. Its ODM, OEM, and SDK capabilities further indicate the ability to support both design-led and technically integrated projects.
Product Q&A
Q:What motherboard types are supported?
A:
This case supports Micro ATX and ITX motherboards.
Q:Does the case include a power supply?
A:
No, the power supply is not included but is optional.
Q:What are the cooling options for this case?
A:
It supports up to 3 front fans (12cm or 14cm) or a 280mm water cooler, 2 top fans or a 240mm water cooler, and 1 rear fan.
Q:What is the minimum order quantity (MOQ)?
A:
The minimum order quantity is 500 pieces.
Q:Is customization available for this product?
A:
Yes, we offer OEM and ODM services including full customization from samples or designs.
Send Inquiry
*To:
Segotep Electronic Technology Co., Ltd.
Segotep Electronic Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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