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Segotep Eatx Motherboard Side Panel and Front Panel Both Tempered Glass Gaming Case
US$42.50
100 Pieces
Product profile
Customization
AvailableCompatible Mainboard
E-ATXPower Supply
Without Power SupplyModel NO.
VistaCase Structure
EATXType
TowerMaterial
Steel plateColor
WhiteFront Interface
USB3.0Cable Management
Non Back Cable ManagementMaximum Lenght of Graphics Card
>400mmSheet Thickness
0.6mmTransport Package
517mm*375mm*555mmSpecification
473mm*285mm*445mmTrademark
SegotepOrigin
ChinaHS Code
8473309000Production Capacity
10000Key features
Dual Tempered Glass Design: Features both motherboard side panel and front panel made of tempered glass for a premium look.
E-ATX Full Compatibility: Supports E-ATX, ATX, M-ATX, and ITX motherboards with ample internal space.
Extensive Cooling Support: Supports up to 360mm water coolers and multiple 12/14cm fans across top, rear, bottom, and interboard positions.
High-End Connectivity: Front interface includes USB 3.0, USB 2.0, Type-C, and HD Audio for versatile device connections.
Large GPU Clearance: Accommodates graphics cards up to 435mm in length, supporting high-end performance cards.
Flexible Storage Options: Provides 4x 3.5-inch HDD bays and 4x 2.5-inch SSD bays for extensive storage expansion.
Professional OEM/ODM Service: Offers full customization, minor customization, and flexible customization options for brands.
Rigorous Quality Control: 100% finished product inspection with advanced EMC and temperature testing systems.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: >24h
AI-Powered supplier vetting
SummaryThe supplier is identified as a manufacturing factory located in Boluo County, Huizhou, China, with combined company characteristics. It demonstrates documented R&D processes, recent new-product development, 3D software design, ODM/OEM services, SDK availability, and broad customization capabilities. Production-related evidence includes automated inspection, screwing, wave soldering, burn-in testing, packaging, and documented finished-product inspection procedures. Quality systems include traceability for raw materials, quality assurance, complaint-handling procedures, and corrective/preventive action records. The supplier has participated in several offline trade shows and offers stated service quotation and payment terms, but no overseas warehouses, showrooms, agents, or branches. Certification holdings, financial credibility, and specific customer cases are not sufficiently documented in the provided information.
Supplier typeThe supplier is described as a factory in the manufacturing industry, located in Boluo County, Huizhou, and classified as a combined company. This supports a direct manufacturing-supplier profile rather than an offshore company.
After-Sales capabilityTechnology engineers are responsible for technical support during production and after-sales service. The supplier also reports documented complaint-handling procedures and records, as well as corrective and preventive action procedures with records, indicating an established support and remediation process.
R&D capabilityThe supplier reports new-product development during the past year, dedicated engineering responsibilities, auditable R&D design-input/output, review, verification, and validation documentation, plus ODM capability and SDK availability. These findings provide explicit evidence of structured product-development and technical innovation capability.
Production capacityProduction evidence includes AOI, automated inspection, automatic screwing, burn-in testing, wave soldering, and heat-shrink packaging facilities. Finished-product inspection instructions are uniformly followed, while supplier-service procedures, approved-supplier controls, quality assurance, raw-material traceability, and stated lead times further support operational capability.
Customization capabilityThe supplier explicitly provides 3D software design and supports customization from samples, designs, full customization, minor customization, and flexible customization. Its ODM, OEM, and SDK capabilities further indicate the ability to support both design-led and technically integrated projects.
Product Q&A
Q:What motherboard sizes are supported?
A:
The case supports E-ATX, ATX, M-ATX, and ITX motherboards.
Q:Does it support liquid cooling?
A:
Yes, it supports up to 360mm water coolers on the top and interboard positions.
Q:What are the front panel connectivity options?
A:
It features 2x USB 2.0, 2x USB 3.0, 1x Type-C, and HD Audio ports.
Q:Is the product customizable?
A:
Yes, we offer full customization, minor customization, and flexible customization from samples or designs.
Q:What is the minimum order quantity (MOQ)?
A:
The minimum order quantity is 500 pieces.
Send Inquiry
*To:
Segotep Electronic Technology Co., Ltd.
Segotep Electronic Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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