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Vertical Install 3 Slots Graphics Card-Segotep-Gank360-Magnetic Absorb Fast Dismantle Panel-Gaming DIY-PC Case
US$30.00
100-299 Pieces
US$28.60
300-499 Pieces
US$28.00
500-999 Pieces
US$27.00
1,000+ Pieces
Sample price:US$30.00/piece.Request sample
Product profile
Customization
AvailableCompatible Mainboard
E-ATXPower Supply
Without Power SupplyCase Structure
EATXType
TowerMaterial
Steel plateColor
BlackFront Interface
USB3.0Cable Management
Back Cable ManagementMaximum Lenght of Graphics Card
300-400mmSheet Thickness
0.6mmTransport Package
CartonSpecification
461*221*488mmTrademark
SegotepOrigin
Huizhou City, Guangdong Province, ChinaHS Code
013250Production Capacity
1000000Key features
Magnetic Fast Dismantle: Features magnetic absorb panel for quick and easy dismantling and assembly.
360mm Cooling Support: Front and top panels support 240mm, 280mm, and 360mm water-cooling radiators.
Premium Glass Panel: Constructed with a 4mm slide rail glass panel for aesthetic appeal.
High Capacity Storage: Supports up to 2 3.5-inch HDDs and 3 2.5-inch SSDs.
Flexible I/O Options: Offers standard USB3.0 and optional Type-C with USB3.0 interfaces.
Robust Structure: Made from 0.8mm thick SPCC steel plate for durability.
Global Brand Trust: Segotep is a top 3 global PC component brand with 11 years of export experience.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 11 years CertifiedNearest Port: Shenzhen PortAverage Response Time: >24h
AI-Powered supplier vetting
SummaryThe supplier is identified as a manufacturing factory located in Boluo County, Huizhou, China, with combined company characteristics. It demonstrates documented R&D processes, recent new-product development, 3D software design, ODM/OEM services, SDK availability, and broad customization capabilities. Production-related evidence includes automated inspection, screwing, wave soldering, burn-in testing, packaging, and documented finished-product inspection procedures. Quality systems include traceability for raw materials, quality assurance, complaint-handling procedures, and corrective/preventive action records. The supplier has participated in several offline trade shows and offers stated service quotation and payment terms, but no overseas warehouses, showrooms, agents, or branches. Certification holdings, financial credibility, and specific customer cases are not sufficiently documented in the provided information.
Supplier typeThe supplier is described as a factory in the manufacturing industry, located in Boluo County, Huizhou, and classified as a combined company. This supports a direct manufacturing-supplier profile rather than an offshore company.
After-Sales capabilityTechnology engineers are responsible for technical support during production and after-sales service. The supplier also reports documented complaint-handling procedures and records, as well as corrective and preventive action procedures with records, indicating an established support and remediation process.
R&D capabilityThe supplier reports new-product development during the past year, dedicated engineering responsibilities, auditable R&D design-input/output, review, verification, and validation documentation, plus ODM capability and SDK availability. These findings provide explicit evidence of structured product-development and technical innovation capability.
Production capacityProduction evidence includes AOI, automated inspection, automatic screwing, burn-in testing, wave soldering, and heat-shrink packaging facilities. Finished-product inspection instructions are uniformly followed, while supplier-service procedures, approved-supplier controls, quality assurance, raw-material traceability, and stated lead times further support operational capability.
Customization capabilityThe supplier explicitly provides 3D software design and supports customization from samples, designs, full customization, minor customization, and flexible customization. Its ODM, OEM, and SDK capabilities further indicate the ability to support both design-led and technically integrated projects.
Product Q&A
Q:Does this case include a power supply?
A:
No, the power supply is not included with the case.
Q:What is the minimum order quantity (MOQ)?
A:
The minimum order quantity is 500 PCS.
Q:Can the product be customized?
A:
Yes, we offer OEM, ODM, and various customization options including samples, designs, and flexible customization.
Q:What are the payment terms?
A:
We accept T/T and LC as terms of payment.
Q:What is the lead time for production?
A:
Peak season lead time is one month, while off-season lead time is within 15 workdays.
Send Inquiry
*To:
Segotep Electronic Technology Co., Ltd.
Segotep Electronic Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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