Powered by Made-in-China.com
Asm Ad832I Fully Automatic Die Bonder, High Speed Semiconductor Packaging Machine
US$100,000.00-120,000.00
1 Piece
Product specifications
Net Weight
Product profile
Customization
AvailableSpeed
High SpeedPrecision
High PrecisionModel NO.
ASM AD832ICertification
CCC, PSE, FDA, RoHSAutomatic Grade
AutomaticType
Die Bonding MachineEquipment Type
Fully Automatic Die Bonding MachineBonding Accuracy
±15μmMax Processing Speed
12000 Dies Per HourApplicable Die Size
0.3mm-12mmWorking Voltage
220V 50/60HzTransport Package
Wooden CaseTrademark
ASMOrigin
SingaporeHS Code
8479896200Key features
High-Speed Production: Max processing speed up to 12000 dies per hour for large-volume mass production.
Wide Die Size Compatibility: Supports die sizes from 0.3mm to 12mm for IC, LED, and microchip packaging.
Stable Mechanical Structure: Ensures long-term continuous running with low failure rate for workshop operations.
User-Friendly Interface: Convenient parameter setup and fast product changeover for flexible switching.
Comprehensive OEM/ODM Support: Offers flexible customization from samples, designs, and full customization options.
Global Logistics Network: Partners with TNT, FedEx, DHL, EMS, and UPS for safe and efficient delivery.
Professional After-Sales Service: Free replacement parts for quality issues within the warranty period.
Company profile
CertifiedBusiness Type: Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.61hTerms of Payment: LC, T/T, D/P, etc.
AI-Powered supplier vetting
SummaryThe supplier is a Shenzhen-based factory in the manufacturing industry, focused on SMT equipment, spare parts, consumables, feeders, precision maintenance, calibration, jigs, and automated non-standard products. It demonstrates broad customization capability, OEM service for popular brands, documented complaint-handling and corrective-action procedures, and stated lead times within 15 working days in both peak and off-peak seasons. However, it has no supplier-management-system certification, no in-stock or overseas warehouse/showroom capability, no available SDK, no new products launched in the past year, and only one year of total R&D engineer experience is reported. Financial evidence is limited to year labels without substantive performance values, while customer coverage is described generally rather than through named cases.
Supplier typeThe supplier is identified as a factory located in Bao'an District, Shenzhen, within the manufacturing industry. Its stated activities cover SMT and semiconductor equipment support, spare parts and consumables, precision maintenance and calibration, jig production, and automated and electronic products.
CertificationsThe supplier-management-system certification field is explicitly recorded as NIL. This indicates no certification is evidenced for this field.
After-Sales capabilityThe supplier has clear procedures and followed records for corrective and preventive actions and customer complaint handling. Its service scope includes equipment relocation, maintenance, care, and precision calibration, while stated average peak and off-season lead times are within 15 working days.
Production capacityThe supplier operates as a manufacturing factory with a 600.0 m² plant and offers precision parts, jigs, automated non-standard products, SMT equipment support, and related products. It reports 80 qualified service suppliers and lead times within 15 working days, but has no in-stock capacity and no overseas warehouse or showroom.
Customization capabilityThe supplier explicitly offers customization from samples, customization from designs, full customization, minor customization, and flexible customization. Its product scope also includes precision parts, jigs, and automated non-standard products, directly supporting customized production needs.
Product Q&A
Q:What services do you provide?
A:
We are a professional supplier of SMT machines and spare parts based in Shenzhen, China. We supply a complete range of SMT equipment and support customized OEM & ODM services.
Q:What is your MOQ?
A:
We support 1 unit minimum order, and mixed orders are also acceptable.
Q:What are your payment terms?
A:
Full payment is required before shipment. One-time full payment or installment payment are both available.
Q:How long is your delivery time?
A:
Generally, goods will be delivered within 7 working days after receiving your full payment.
Q:What should I do if the machine has problems after delivery?
A:
Within the warranty period, we provide free replacement parts for any quality-related machine issues.
Send Inquiry
*To:
Shenzhen Tengxiangjia Technology Co., Ltd.
Shenzhen Tengxiangjia Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
You may also like
12inch Fully Automatic Soft Solder Die Bonding Machine Factory for Semiconductor Assembly
US$7,000.00-70,000.00
1 Piece(MOQ)
Automatic High Precision Die Bonder Die Bonding Machine for COB Box to Tec Mems HDMI
US$140,000.00-220,000.00
1 Piece(MOQ)
Semiconductor Wafer Packaging Welding Equipment Laser Vision Micro Desktop Automatic Solidification Machine Die Bonder Bonding
US$116,000.00-150,000.00
1 Piece(MOQ)
High Precision Die Bonder Ad832I, Fully Automatic Semiconductor Die Bonding Machine
US$100,000.00-120,000.00
1 Piece(MOQ)
Used Asm Siplace X4I High-Speed 4-Gantry SMT Chip Mounter, High Precision Pick & Place Machine for PCB & Semiconductor Assembly Line
US$70,000.00-80,000.00
1 Piece(MOQ)
Semiconductor Packaging Ad832I Fully Automatic Die Bonding Machine
US$100,000.00-120,000.00
1 Piece(MOQ)
High-Precision Automatic Die Bonding Machine for Semiconductor Manufacturing
US$100,000.00-1,000,000.00
1 Piece(MOQ)
K&S Maxum Plus Automatic Gold Ball Wire Bonder, High-Speed Semiconductor Bonding Machine for IC & LED Packaging
US$23,000.00-40,000.00
1 Piece(MOQ)
Semiconductor High End Wafer Bonder High-Precision Die Bonding Machine Made in China
US$100,000.00-1,000,000.00
1 Piece(MOQ)
High-Precision Automatic Die Bonding Machine for Semiconductor Applications
US$7,000.00-70,000.00
1 Piece(MOQ)
High-Speed Fully Automatic SMT Pick and Place Machine China Machine
US$55,000.00
1 Piece(MOQ)
SMT Fully Automatic High-Speed YAMAHA Chip Placement Machine Yv180xg Picking and Placing Machine
US$14,000.00-15,500.00
1 Piece(MOQ)
Fully Automatic Juki Semiconductor Equipment Acf Chip Machine
US$82,500.00
1 Piece(MOQ)
New and Used High Speed Precision Fully Automatic Hanwha SMD SMT Line LED Mounter Pick and Place Machine
US$30,000.00-70,000.00
1 set(MOQ)
China Semiconductor High Frequency Die Cof Manufacturing Equipment Asmpt Ab383 Fully Automatic Acf Wire Wafer Bonding Machine
US$45,000.00-68,000.00
1 Set(MOQ)






