Powered by Made-in-China.com
High Accuracy Die Bonder with Epoxy and Eutectic
US$90,500.00-119,000.00
1 Piece
Product profile
After-sales Service
Online and Video ServiceCondition
NewSpeed
Medium SpeedModel NO.
DB100Precision
High PrecisionCertification
CEWarranty
12 MonthsAutomatic Grade
SemiautomaticType
Medium-speed Chip MounterMax. Chip Size
Smaller 20mm X20mm(50*50mm Optional)Min. Chip Size
0.2*0.2mmMounting Precision
±3um 3δFeeding Mode
2 Inch Waffle Box*2Substrate Size
150*150mmX Y Z Axis Motion System
Roller Screw + Servo MotorX Y Axis Resolution
0.1umPower Supply
220V, 50HzNet Weight
150kgTransport Package
Polywood CaseSpecification
800 * 750 * 630mmTrademark
TERMWAYOrigin
Beijing, ChinaKey features
Sub-Micron Precision: Marble motion platform ensures sub-micron level accuracy for high-precision chip assembly.
Versatile Applications: Ideal for medical imaging, optical devices, and semiconductor chips like MEMS and RF devices.
Advanced Laser System: Integrated laser height measurement supports deep cavity substrate patch and eutectic welding.
Customizable Modules: Optional modules include UV curing, nitrogen protection, and nozzle heating for diverse needs.
High Cost Performance: Stable performance and high precision make it suitable for R&D and small batch production.
Flexible Configuration: Nozzles can be manually replaced to accommodate different chip sizes from 0.2mm to 50mm.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading CompanyExport Year: 2012-04-10 CertifiedNearest Port: Tianjin PortAverage Response Time: ≤15h CertifiedTerms of Payment: LC, T/T CertifiedInternational Commercial Terms(Incoterms): FOB, CIF
About Our Factory & Business Background
Address12i Factory Building, No 15, Jingsheng South 4th Street, Jinqiao Science and Technology Industrial Base, Zhongguancun High-Tech Park, Tongzhou District, Beijing
Plant Area1100 square meters
Number of Employees28
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Main ProductsPCB Assembly, Pick&Place Machine, Reflow Oven/Wave Machine, Screen Printer, Dispenser
Production MachinesDial indicator, Bench driller, Multimeter, AOI tester
R&D Engineers6 people
Own BrandYes
Our Industry Experience & Global Business Record
Year of Establishment2012-07-31
Main MarketsNorth America, Europe, East Asia(Japan/ South Korea)
Number of Foreign Trading Staff5
Overseas Agent/BranchYes
Product Q&A
Q:What types of chips can this machine handle?
A:
It handles chips ranging from 0.2*0.2mm to 20*20mm (50*50mm optional) using a 2-inch waffle box feeding mode.
Q:Is the machine fully automatic?
A:
No, it is a manual-semi-automatic micro assembly placement system with semiautomatic grade.
Q:What optional modules are available?
A:
Options include nozzle heating, pressure feedback, UV dispensing, nitrogen protection, substrate preheating, and chip flip placing.
Q:What is the warranty period?
A:
The machine comes with a 12-month warranty.
Q:What is the lead time for production?
A:
The average lead time is one month for both peak and off-season periods.
Send Inquiry
*To:Termway (Beijing) Precision Technology Co., Ltd.
Termway (Beijing) Precision Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
You may also like
0.5um Ultra-High-Precision Micro-Assembly Sub-Micron Submicron Die Bonder Epoxy Die Attach
US$99,999.00-999,999.00
1 Piece(MOQ)
China Small Eutectic Die Bonder with Heated Collet Bond Head
US$90,500.00-119,000.00
1 Piece(MOQ)
0.8 to 25mm Chip Epoxy Die Bonder with TCP/IP Factory Price
US$7,000.00-70,000.00
1 Piece(MOQ)
Semi Automatic Flip Chip Die Bonder Semiautomatic with High Precision Termway
US$90,500.00-119,000.00
1 Piece(MOQ)
High-Precision Wafer Die Bonder with Smart Control Technology
US$100,000.00-1,000,000.00
1 Piece(MOQ)
0.5μm Various Precision Positioning High-End Packaging Processes Sub-Micron Eutectic Die Bonder
US$10,000.00-90,000.00
1 Piece(MOQ)
Semiconductor High Precision Asmpt Siplace Ca2 Plus Die Bonding and Flip Chip Placement Bonder
US$100,000.00-1,000,000.00
1 Set(MOQ)
High Precision R&D Using Small Die Bonder Can Reach Die Bonder, Soldering and Glue Dispensing
US$90,500.00-119,000.00
1 Piece(MOQ)
High-Speed Automatic Epoxy Die Bonder for Precision Manufacturing
US$7,000.00-70,000.00
1 Piece(MOQ)
Small Semiconductor Die Bonding System, Wafer Die Attach Eutectic Bonder dB100
US$90,500.00-119,000.00
1 Piece(MOQ)
Desktop Laboratory Gantry High-Precision Small Multifunctional Automatic Die Attach Die Mounter Automatic Eutectic Patch Chip Bonder
US$116,000.00-150,000.00
1 Piece(MOQ)
Factory Direct Sales Asm High Speed LED Clip Wafer Die Bonder Ad50PRO
US$100,000.00-1,000,000.00
1 Set(MOQ)
Gkg High-Speed Flexible Tape Die Bonder with Precision Dispensing & Auto Film Expanding
US$12,500.00-38,000.00
1 Piece(MOQ)
High Precision Asm Die Bonder Ad819 Dispensing Equipment for Semiconductor Packaging Solutions
US$10,000.00-1,000,000.00
1 Set(MOQ)
Right M90-L Fully Automatic Die Bonder High Precision LED PCB Chip Mounting Machine
US$22,500.00-38,000.00
1 Piece(MOQ)
High-Precision Back-End Semiconductor Equipment Supplier Used Newport Mrsi-705 Die Bonder
US$490,000.00-660,000.00
1 Piece(MOQ)
High-Precision Eutectic Die Bonder for Superior Wafer Production
US$300,000.00-500,000.00
1 Piece(MOQ)
China Used Besi Datacon 8800 FC Quantum Advx Manufactures Automatic Ball Wire Flip Chip Wedge Die Bonder
US$158,000.00-259,500.00
1 Piece(MOQ)
Gkg Gd91m6 Multi-Station Die Bonder High Accuracy for Display Module Manufacturing
US$32,500.00-38,000.00
1 Piece(MOQ)