High-Speed Automatic Epoxy Die Bonder for Precision Manufacturing

Name: High-Speed Automatic Epoxy Die Bonder for Precision Manufacturing
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 1962517141

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$7,000.00-70,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

Free Training

Condition

New

Model NO.

DBM-1029

Speed

Super High Speed

Precision

High Precision

Certification

RoHS, ISO, CE

Warranty

24 Months

Automatic Grade

Automatic

Type

Ultra High-speed Chip Mounter

Product Name

Die Bonder Machine

Item Number

Shark-1

Leading Production Capacity

20000uph

Welding Head Force

30- 300 G

Wafer Size

12~8 Inches

Transport Package

Wooden Box by Sea Shipping

Specification

standard package

Trademark

Himalaya

Origin

China

Production Capacity

5000

Key features

Ultra High-Speed Performance: Achieves up to 20,000 units per hour (UPH) for maximum throughput and ROI.

Broad Wafer Compatibility: Supports 8-inch and 12-inch wafers with a universal track design for quick changeover.

Flexible Customization: Offers OEM, ODM, and flexible customization options for specific machine needs.

Advanced Dispensing Control: Features precision-controlled dispensing for optimal silver paste application and bond integrity.

Comprehensive Warranty: Provides 24 months warranty with 24-hour online professional technical support.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤1.66h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.

Q:Why choose us?

OEM/ODM/Designing.

Q:What is the production capacity of this machine?

The machine achieves up to 20,000 units per hour (UPH) for high-volume manufacturing.

Q:What wafer sizes are supported?

The system supports wafers up to 12 inches and 8 inches with a universal track design.