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Solder ball manufacturers

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Guangzhou Xianyi Electronic Technology Co., Ltd.mic-icon
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Ausn Solder Ball for Mcroelectronics Packaging Such as BGA, SIP, Stacked Chip

Ausn Solder Ball for Mcroelectronics Packaging Such as BGA, SIP, Stacked Chip

US$0.06
50,000 Pieces(MOQ)
Sample Available
High Reliability Au78Sn22 Solder Ball for Aerospace Electronic Packaging

High Reliability Au78Sn22 Solder Ball for Aerospace Electronic Packaging

US$5.00-50.00
500 k pcs(MOQ)
Sample Available
Uniform Particle Size Au80Sn20 Solder Ball for Precision IC Packaging

Uniform Particle Size Au80Sn20 Solder Ball for Precision IC Packaging

US$5.00-50.00
500 k pcs(MOQ)
Sample Available
High Compatibility Au78Sn22 Solder Ball for Heterogeneous Integrated Chip Packaging

High Compatibility Au78Sn22 Solder Ball for Heterogeneous Integrated Chip Packaging

US$5.00-50.00
500 k pcs(MOQ)
Sample Available
Low Oxidation Au78Sn22 Solder Ball for Stacked Chip Packaging

Low Oxidation Au78Sn22 Solder Ball for Stacked Chip Packaging

US$5.00-50.00
500 k pcs(MOQ)
Sample Available
Custom Specification Au80Sn20 Solder Ball for RF Device Packaging

Custom Specification Au80Sn20 Solder Ball for RF Device Packaging

US$5.00-50.00
500 k pcs(MOQ)
Sample Available
High-Precision Au80Sn20 Solder Ball for BGA Microelectronic Packaging

High-Precision Au80Sn20 Solder Ball for BGA Microelectronic Packaging

US$5.00-50.00
500 k pcs(MOQ)
Sample Available
Ultra-Fine Diameter Au80Sn20 Solder Ball for Micro Sensor Packaging

Ultra-Fine Diameter Au80Sn20 Solder Ball for Micro Sensor Packaging

US$5.00-50.00
500 k pcs(MOQ)
Sample Available
Low Void Au78Sn22 Solder Ball for Third-Generation Semiconductor Sic Packaging

Low Void Au78Sn22 Solder Ball for Third-Generation Semiconductor Sic Packaging

US$5.00-50.00
500 k pcs(MOQ)
Sample Available
High Purity Au78Sn22 Solder Ball for Optoelectronic Device Packaging

High Purity Au78Sn22 Solder Ball for Optoelectronic Device Packaging

US$5.00-50.00
500 k pcs(MOQ)
Sample Available
Anti-Oxidation Au78Sn22 Solder Ball for Csp Chip Scale Packaging

Anti-Oxidation Au78Sn22 Solder Ball for Csp Chip Scale Packaging

US$5.00-50.00
500 k pcs(MOQ)
Sample Available
High Conductivity Au80Sn20 Solder Ball for High-Frequency Communication Device Packaging

High Conductivity Au80Sn20 Solder Ball for High-Frequency Communication Device Packaging

US$5.00-50.00
500 k pcs(MOQ)
Sample Available
Large Particle Size Au80Sn20 Solder Ball for Power Module Packaging

Large Particle Size Au80Sn20 Solder Ball for Power Module Packaging

US$5.00-50.00
500 k pcs(MOQ)
Sample Available
Small Diameter Au80Sn20 Solder Ball for Micro SIP Packaging

Small Diameter Au80Sn20 Solder Ball for Micro SIP Packaging

US$5.00-50.00
500 k pcs(MOQ)
Sample Available
High Hermeticity Au80Sn20 Solder Ball for Mems Device Packaging

High Hermeticity Au80Sn20 Solder Ball for Mems Device Packaging

US$5.00-50.00
500 k pcs(MOQ)
Sample Available
High Roundness Au80Sn20 Solder Ball for Flip Chip Packaging

High Roundness Au80Sn20 Solder Ball for Flip Chip Packaging

US$5.00-50.00
500 k pcs(MOQ)
Sample Available
High Corrosion Resistance Au78Sn22 Solder Ball for Military Electronic Packaging

High Corrosion Resistance Au78Sn22 Solder Ball for Military Electronic Packaging

US$5.00-50.00
500 k pcs(MOQ)
Sample Available
Aging Resistant Au78Sn22 Solder Ball for Industrial Control Chip Packaging

Aging Resistant Au78Sn22 Solder Ball for Industrial Control Chip Packaging

US$5.00-50.00
500 k pcs(MOQ)
Sample Available
Ultra-Fine Solder Balls for Micro Electronics and PCB Assembly

Ultra-Fine Solder Balls for Micro Electronics and PCB Assembly

US$5.00-50.00
500 k pcs(MOQ)
Sample Available
High Purity In80pb15AG5 Solder Preform, Low Stress Alloy Preformed Solder for Semiconductor Bonding

High Purity In80pb15AG5 Solder Preform, Low Stress Alloy Preformed Solder for Semiconductor Bonding

US$0.05-20.00
50 Pieces(MOQ)
Sample Available
High Density In97AG3 Solder Preform for Micro Assembly Precision Bonding

High Density In97AG3 Solder Preform for Micro Assembly Precision Bonding

US$1.00
200 Pieces(MOQ)
Sample Available
Low Temperature Resistant In50sn50 Solder Preform for Aerospace Cryogenic System

Low Temperature Resistant In50sn50 Solder Preform for Aerospace Cryogenic System

US$1.00
200 Pieces(MOQ)
Sample Available
Ultra-Thin In52sn48 Solder Preform for Ultra-Low Temperature Micro Packaging

Ultra-Thin In52sn48 Solder Preform for Ultra-Low Temperature Micro Packaging

US$1.00
200 Pieces(MOQ)
Sample Available
Mini Size In100 Solder Preform for Micro Sensor Interconnection

Mini Size In100 Solder Preform for Micro Sensor Interconnection

US$1.00
200 Pieces(MOQ)
Sample Available
Ausn Preforms Gold-Tin Solder for High Temperature Power Devices

Ausn Preforms Gold-Tin Solder for High Temperature Power Devices

US$0.05-20.00
50 Pieces(MOQ)
Sample Available

Sourcing guidance for Solder Ball

What are the key technical specifications to consider when selecting solder balls for BGA packaging?

When sourcing solder balls, the alloy composition is the most critical factor. You must choose between Lead-Free (SnAgCu - SAC305/SAC405) for RoHS compliance or Leaded (Sn63Pb37) for specific aerospace/military applications. Additionally, sphericity and diameter tolerance (typically within ±0.01mm) are vital to ensure uniform coplanarity during the reflow process. High-quality balls should have a smooth, bright surface free of oxidation to ensure optimal wetting.

How do I determine the appropriate size and grade for my application?

Solder balls are categorized by diameter, ranging from 0.05mm to 0.76mm. For high-density Flip Chip or CSP (Chip Scale Packaging), smaller diameters are required. You should also verify the Alpha-particle emission rate (Low Alpha or Ultra-Low Alpha) if the product is intended for high-reliability memory chips or processors to prevent Soft Errors caused by radiation.

What compliance standards must solder balls meet for international trade?

Suppliers must provide RoHS (Restriction of Hazardous Substances) and REACH certification for lead-free products. For electronic grade materials, adherence to IPC-7095 (Design and Assembly Process Implementation for BGA) and J-STD-006 (Requirements for Electronic Grade Solder Alloys) is essential to guarantee chemical purity and performance consistency.

How can I evaluate the storage and shelf-life requirements of solder balls?

Solder balls are highly sensitive to oxidation and humidity. Ensure the supplier uses vacuum-sealed packaging with nitrogen flushing and includes desiccant packs. The typical shelf life is 6 to 12 months when stored in a temperature-controlled environment (20-25°C) with humidity below 60% RH. Always check the production date before finalizing a bulk purchase.

Cross-Border Procurement Risks and Strategies for Solder Balls

What are the primary risks when importing solder balls from overseas suppliers?

The biggest risk is oxidation during transit, which can lead to poor soldering joints and high defect rates. To mitigate this, specify hermetic packaging requirements in your contract. Another risk is alloy purity fraud; always request a COA (Certificate of Analysis) for every batch and consider using third-party lab testing to verify the silver (Ag) content in SAC alloys, as this significantly impacts the price.

How should I negotiate pricing and MOQs with specialized chemical/metal suppliers?

Solder ball pricing is heavily tied to London Metal Exchange (LME) daily rates for Tin (Sn) and Silver (Ag). Negotiate a formula-based pricing model rather than a fixed price for long-term contracts. For MOQs, many top-tier manufacturers on Made-in-China.com offer sample jars (e.g., 250k to 500k balls per jar) to allow for technical validation before committing to high-volume industrial quantities.

What are the best practices for shipping and logistics for these precision components?

Solder balls are heavy but fragile in terms of surface integrity. Use express air freight (DHL/FedEx/UPS) for small to medium batches to minimize time in uncontrolled environments. Ensure the outer cartons are double-walled and shock-resistant to prevent the balls from deforming or rubbing against each other, which can create metallic dust and affect placement accuracy.

How can I ensure transaction security and supplier reliability?

Prioritize Audited Suppliers on Made-in-China.com who have undergone on-site factory inspections. Use Secured Payment services to ensure funds are only released upon proof of shipment. For first-time orders, it is highly recommended to hire a third-party inspector to perform a Pre-Shipment Inspection (PSI) to check the vacuum seal integrity and quantity accuracy.

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