Powered by Made-in-China.com
Advanced Fully Automatic Green Laser Dicing System for Sic Wafers
US$50,000.00-200,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
ProvidedWarranty
12 MonthsModel NO.
GLC-01Application
Home Appliance, Environmental Equipment, Automotive IndustryCooling System
Air CoolingTechnical Class
Continuous Wave LaserApplicable Material
MetalStructure Type
Gantry TypeLaser Classification
Free Electron LaserLaser Technology
Laser Control Fault CuttingLaser Source
532nm Green Laser, 30WMotion System
Linear Motors (X/Y-Axis: 200mm) + Ball Screw Z-AxiVision System
Custom CCD Monitoring SystemControl System
Ky-Urcutting Motion Control SoftwareDimensions
1410 × 1350 × 2070mmWeight
1090kgMaterials
Brittle Materials, High-Hardness MetalsProcessing Area
150×150mmCutting Precision
±0.05mmTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaCompany profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤0.93h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
*Content:
Supplier replies will be sent to your registered email
You may also like
High-Precision GaN Wafer Laser Dicing System for Semiconductors
US$200,000.00-300,000.00
1 Piece(MOQ)
Automatic Dual Table Fiber Laser Cutting System with Water Cooling for Brass and Aluminum Plates
US$15,000.00-26,000.00
1 Piece(MOQ)
Automatic System for Plate Laser Cutting Machine for 3015 Format Sheet Metals
US$47,000.00-85,000.00
1 set(MOQ)
Next-Gen Hybrid Laser Cutting System for Rail Transport
US$28,800.00-29,500.00
1 Piece(MOQ)
Hsg Laser Automatic Pallet Racks for Metal Sheets Automatic Systems for Plate Loading and Unloading Racking
US$98,000.00-148,000.00
1 set(MOQ)
Advanced Fiber Laser Cutting System 6000W 12000W for Aerospace
US$13,900.00-16,900.00
1 Piece(MOQ)
Advanced Laser Engraving System for High Precision Glass Cutting
US$158,000.00-186,000.00
1 Piece(MOQ)
Long Lifespan Automatic Fiber Laser Cutting System for Electrical Appliance Housings
US$15,800.00-22,000.00
1 Piece(MOQ)
Customized Automatic Material Handling System for Industrial Laser Cutters
US$47,000.00-85,000.00
1 set(MOQ)
High Power Automatic Fiber Laser Cutting System for Irregularly Shaped Parts
US$15,800.00-22,000.00
1 Piece(MOQ)
Automatic Loading System for Laser Cutting Steel Sheet Storage
US$47,000.00-85,000.00
1 set(MOQ)
Advanced Fiber Laser Cutting System 2000W 3000W for Precision Engineering
US$13,900.00-16,900.00
1 Piece(MOQ)
Advanced 355nm UV Laser System for PCB Depaneling
US$100,000.00-1,000,000.00
1 Piece(MOQ)
High-Precision 3000W and 6000W Laser Cutter for Steel Structures
US$28,800.00-29,500.00
1 Piece(MOQ)
Advanced 2000W Fiber Laser Cutting System for Precision Fabrication
US$5,699.00-5,888.00
1 Piece(MOQ)
Advanced CNC Laser Cutting System for Metal Sheets
US$15,000.00-70,000.00
1 Set(MOQ)
Advanced 6000W Ai-Driven Laser Cutting System for Tubes
US$14,999.00-19,999.00
1 Piece(MOQ)
Advanced CO2 Laser Cutting System for Accurate Material Processing
US$20,000.00-35,000.00
1 Piece(MOQ)
Advanced CO2 Laser Cutting System for Accurate Material Processing
US$20,000.00-35,000.00
1 Piece(MOQ)
Efficient Automated Wafer Handling System for Enhanced Output
US$50,000.00-100,000.00
1 Piece(MOQ)


















