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Advanced IGBT Laser Annealing for Enhanced Dopant Activation

Name: Advanced IGBT Laser Annealing for Enhanced Dopant Activation
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2116996665

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$100,000.00-1,000,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

7*24 Hours

Function

High Temperature Resistance

Model NO.

SI-01

Demoulding

Pull Core

Condition

New

Certification

ISO

Warranty

12 Months

Automatic Grade

Automatic

Installation

Vertical

Driven Type

Electric

Mould Life

<300,000 Shots

Product Name

IGBT Laser Annealing

Compatible Wafer Size

6 Inch, 8 Inch, 12 Inch

Laser Energy Density

≥ 5 J/Cm² × 2

Activation Efficiency

≥ 95% for Boron (B+)

Sheet Resistance (RS) Uniformity

Within Wafer (Wiw): ≤ 1% (3σ)

Laser Power Configuration

60W × 2 to 90W × 2 + 300W

P+ Activation Efficiency

≥ 90% for Phosphorus (P+)

RS Uniformity

Wafer to Wafer (Wtw): ≤ 1% (3σ)

OEM/ODM Service

Provided

Feature 2

Independly Developped Optical System

Transport Package

Customized or Wooden Box Packaging

Specification

Standard Specifications

Trademark

Himalaya

Origin

China

Production Capacity

100

Key features

Excellent Thermal Budget Control: Ensures precise temperature management for optimal dopant activation.

Flexible Wafer Compatibility: Supports 6-inch, 8-inch, and 12-inch wafer sizes.

Advanced Optical System: Independently developed optical system for high reliability and stability.

OEM/ODM Services: Flexible customization options available for tailored solutions.

Comprehensive Warranty: Includes 12-month warranty with 24/7 online technical support.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.64h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.

Q:What wafer sizes are compatible?

The machine supports 6-inch, 8-inch, and 12-inch wafer sizes.

Q:Do you offer customization services?

Yes, we provide OEM/ODM services with flexible customization options.

Q:What is the lead time for orders?

Peak season lead time is 3-6 months, and off-season lead time is 1-3 months.