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Automatic Die Bonding Flip Chip and Die Attach Bonder for Soic/So/Qfn/BGA/LGA
US$7,000.00-70,000.00
1 Piece
Sample price:US$5000000.00/piece.Request sample
Product profile
Customization
AvailableAfter-sales Service
12 MonthsCondition
NewModel NO.
FCDB-01Speed
High SpeedPrecision
PrecisionCertification
ISO, CEWarranty
12 MonthsAutomatic Grade
AutomaticType
High-speed Chip MounterAppplication
CocChip Size
0.15 to 1.5mmSubstrate Size
0.15 to 4mmProduction Cycle
70sPatch Pressure
10g to 100gXy Placement Accuracy
+/-1.5um@3sigmaDie Rotation Accuracy
0.3deg@3sigmaSensor Resolution Ratio
3072*2048Transport Package
WoodenSpecification
CustomziedTrademark
HimalayaOrigin
ChinaProduction Capacity
100Key features
High-Speed Flip Chip Bonding: Fully automatic high-speed solution for SOIC, SO, QFN, BGA, and LGA devices.
Dual Process Integration: Combines flip chip and die bonding in one machine with simple process conversion.
Wide Chip Size Compatibility: Handles die sizes from 0.15x0.15mm to 6x6mm and substrates up to 300mm length.
Flexible Customization: ODM and OEM services available with flexible customization options for specific needs.
Comprehensive Inspection: Equipped with a multi-color PR system and 100% visual and function inspection.
Windows OS Control: Operated via MS Windows with flexible connectivity for easy management.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.50h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:What is the warranty period for the machine?
A:
We provide a 12-month warranty covering mechanical defects.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.
Q:Do you offer OEM and ODM services?
A:
Yes, we offer both OEM and ODM services with flexible customization options.
Q:What is the production cycle time?
A:
The standard production cycle is 70 seconds per unit.
Q:What are the payment terms?
A:
We accept LC, T/T, PayPal, and Western Union.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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