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High-Precision Flip Chip Die Bonder for Semiconductor Manufacturing
US$70,000.00-100,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
Online ServiceCondition
NewModel NO.
SF-01Speed
High SpeedPrecision
High PrecisionCertification
ISOWarranty
12 MonthsAutomatic Grade
AutomaticType
Ultra High-speed Chip MounterProduct Name
Semiconductor EquipmentFeature 1
Guaranteed QualityFeature 2
Customized According to NeedsAfter-Sale Service
ProvidedTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaProduction Capacity
50000Key features
Ultra High Speed: Max bonding speed up to 17,000 UPH depending on chip size and density.
Flexible Customization: Customized according to customer needs with flexible customization options.
12 Months Warranty: Comprehensive one-year warranty coverage for the equipment.
24/7 Technical Support: Professional technical support available online 24 hours a day.
ISO Certified Quality: Product meets ISO certification standards for quality assurance.
12-Inch Wafer Support: Compatible with 12-inch wafers and also supports 8-inch wafers.
Company profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.64h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Product Q&A
Q:How to choose a suitable machine?
A:
You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q:What is the warranty period for the equipment?
A:
One year warranty and 24 hours online professional technical support.
Q:What is the maximum bonding speed?
A:
The max bonding speed is 17,000 UPH, which varies with chip size and density.
Q:What wafer sizes are compatible?
A:
The machine is compatible with 12-inch wafers and also supports 8-inch wafers.
Q:Is customization available?
A:
Yes, the machine offers flexible customization and is customized according to customer needs.
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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