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Small Chip Flip Die Bonder for R&D Using dB100s
US$90,500.00-119,000.00
1 Piece
Product profile
After-sales Service
Online and at Site ServiceCondition
NewSpeed
Medium SpeedModel NO.
DB100sPrecision
High PrecisionCertification
ISO, CEWarranty
12 MonthsAutomatic Grade
SemiautomaticType
Medium-speed Chip MounterMax. Chip Size
20mm * 20mm (50*50mm Optional)Min. Chip Size
0.2mm * 0.2mmMounting Precision
±3um 3δFeeding Mode
2 Inch Waffle Box*2Substrate Size
150*150mmX Y Z Axis Motion System
Roller Screw + Servo MotorX Y Axis Resolution
0.1umPower Supply
220V, 50HzNet Weight
300kgTransport Package
Polywood CaseSpecification
800 * 750 * 630mmTrademark
TERMWAYOrigin
Beijing, ChinaKey features
Sub-Micron Precision: Marble motion platform ensures sub-micron level accuracy for high-precision chip assembly.
Versatile R&D Application: Ideal for R&D, small batch, and multi-variety production in medical, optical, and semiconductor fields.
Advanced Laser Measurement: Integrated laser height measurement system supports deep cavity substrate patching and eutectic welding.
Flexible Configuration: Supports optional modules like nozzle heating, UV curing, and nitrogen protection for diverse needs.
High Cost Performance: Combines high precision and stable performance with convenient operation for research institutions.
Wide Chip Compatibility: Handles chip sizes from 0.2mm to 20mm, with manual nozzle replacement for different chip sizes.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading CompanyExport Year: 2012-04-10 CertifiedNearest Port: Tianjin PortAverage Response Time: >24h CertifiedTerms of Payment: LC, T/T CertifiedInternational Commercial Terms(Incoterms): FOB, CIF
About Our Factory & Business Background
Address12i Factory Building, No 15, Jingsheng South 4th Street, Jinqiao Science and Technology Industrial Base, Zhongguancun High-Tech Park, Tongzhou District, Beijing
Plant Area1100 square meters
Number of Employees28
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Main ProductsPCB Assembly, Pick&Place Machine, Reflow Oven/Wave Machine, Screen Printer, Dispenser
Production MachinesDial indicator, Bench driller, Multimeter, AOI tester
R&D Engineers6 people
Own BrandYes
Our Industry Experience & Global Business Record
Year of Establishment2012-07-31
Main MarketsNorth America, Europe, East Asia(Japan/ South Korea)
Number of Foreign Trading Staff5
Overseas Agent/BranchYes
Product Q&A
Q:What are the maximum and minimum chip sizes supported?
A:
The standard DB100 supports up to 20mm x 20mm (50x50mm optional) and down to 0.2mm x 0.2mm. The DB100S supports down to 0.1mm x 0.1mm.
Q:Is the machine suitable for semiconductor chip assembly?
A:
Yes, it is essential for high-precision adhesive bonding in semiconductor chips, including MEMS, RF, microwave devices, and hybrid circuits.
Q:What optional modules are available for this bonder?
A:
Optional modules include nozzle heating, pressure feedback, UV dispensing/curing, nitrogen protection, substrate preheating, process monitoring, and chip flip placing.
Q:What is the warranty period for this equipment?
A:
The equipment comes with a 12-month warranty covering mechanical defects and performance issues.
Q:What is the power supply requirement for the machine?
A:
The machine requires a 220V, 50Hz power supply with a power consumption of 3KW (excluding the eutectic table).
Send Inquiry
*To:Termway (Beijing) Precision Technology Co., Ltd.
Termway (Beijing) Precision Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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