Powered by Made-in-China.com
High-Performance Wafer Bonder for Precision Chip Assembly Solutions
US$100,000.00-1,000,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
ProvidedCondition
NewModel NO.
SHD8060Speed
High SpeedPrecision
High PrecisionCertification
ISOWarranty
12 MonthsAutomatic Grade
AutomaticType
High-speed Chip MounterProduct Name
Semiconductor EquipmentFeature 1
Guaranteed QualityFeature 2
Customized According to NeedsAfter-Sale Service
ProvidedTransport Package
Customized or Wooden Box PackagingSpecification
Standard SpecificationsTrademark
HimalayaOrigin
ChinaCompany profile
Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤0.01h
About Our Factory & Business Background
AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital100,000,000 RMB
Terms of PaymentLC, T/T, PayPal, Western Union
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Minimum Order Quantity1 Set
Supply Chain Partners30
Our Production Capability & Technical Expertise
Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
Traceability of Raw MaterialsNo
Our Industry Experience & Global Business Record
Year of Establishment2019-09-12
Main MarketsEurope
Repeat Buyers Choice80%~100%
Send Inquiry
*To:
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.*Content:
Supplier replies will be sent to your registered email
You may also like
High-Precision Wafer Die Bonder for Reliable Dispensing Solutions
US$300,000.00-400,000.00
1 Piece(MOQ)
Precision Automatic Wafer Die Bonder for High-Speed Assembly
US$100,000.00-1,000,000.00
1 Piece(MOQ)
Gkg Gd210 Precision Die Bonder - 10-Inch Auto Wafer Ring Changer & Film Expander for 600×510mm Large Substrate Semiconductor Packaging
US$22,500.00-48,000.00
1 Piece(MOQ)
High Precision Asm Die Bonder Ad819 Dispensing Equipment for Semiconductor Packaging Solutions
US$10,000.00-1,000,000.00
1 Set(MOQ)
dB100 Series High Precision Die Bonder Solution
US$30,999.00
1 Set(MOQ)
High-Precision Eutectic Die Bonder for Superior Wafer Production
US$300,000.00-500,000.00
1 Piece(MOQ)
Small Die Bonder Die Pick and Place Machine for Wafer
US$90,500.00-119,000.00
1 Piece(MOQ)
High-Precision Wafer Bonder for Reliable Semiconductor Testing Solutions
US$100,000.00-1,000,000.00
1 Piece(MOQ)
Factory Direct Sales Asm High Speed LED Clip Wafer Die Bonder Ad50PRO
US$100,000.00-1,000,000.00
1 Set(MOQ)
Advanced Wire Bonder for Precision Electronics Assembly and Repair
US$72,000.00
1 Piece(MOQ)
Semi Automatic Flip Chip Die Bonder Semiautomatic with High Precision Termway
US$90,500.00-119,000.00
1 Piece(MOQ)
KOH Young Automatic Optical Inspection 3D Spi Online Machine for PCB SMT Assembly Die Bonder
US$80,000.00
1 Piece(MOQ)
High Precision Flip Chip Die Bonder dB100 Termway
US$90,500.00-119,000.00
1 Piece(MOQ)
Gkg Gd91m6 Multi-Station Die Bonder High Accuracy for Display Module Manufacturing
US$32,500.00-38,000.00
1 Piece(MOQ)
China Used Besi Datacon 8800 FC Quantum Advx Manufactures Automatic Ball Wire Flip Chip Wedge Die Bonder
US$158,000.00-259,500.00
1 Piece(MOQ)
Right M90-L Fully Automatic Die Bonder High Precision LED PCB Chip Mounting Machine
US$22,500.00-38,000.00
1 Piece(MOQ)
Semiconductor Packaging Testing Equipment Supplier Manufacturers YAMAHA Ysh20 Flip Chip Mounter Bonder
US$100,000.00-1,000,000.00
1 Set(MOQ)
Desktop Laboratory Gantry High-Precision Small Multifunctional Automatic Die Attach Die Mounter Automatic Eutectic Patch Chip Bonder
US$116,000.00-150,000.00
1 Piece(MOQ)
High-Precision K&S Maxum Ultra Wire Bonding Machine Used Semiconductor Wire Bonder
US$29,400.00-68,500.00
1 Piece(MOQ)
Gkg Gd80+C Automatic Precision Die Bonder Lightweight Dual Swing Arm for LED & Semiconductor
US$12,500.00-38,000.00
1 Piece(MOQ)